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Senior Packaging Module Engineer - Packaging Innovation

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-05-30
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 155520 - 219550 USD Yearly USD 155520.00 219550.00 YEAR
Job Description & How to Apply Below

Intel Corporation is seeking a Senior Packaging Module Development Engineer in Arizona to design and develop packaging solutions that meet regulatory requirements. This role involves leading the packaging development process, collaborating with various teams, and implementing efficiency improvements. A Master’s or PhD in a relevant field is required, along with expertise in data analysis and packaging assembly processes.

The position requires a strong focus on innovation and sustainability to enhance product transport and delivery.

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Position Requirements
10+ Years work experience
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