Packaging Module Equipment Development Engineer

Job Overview

Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability. Develops process and equipment specifications using DOE, SPC, and data analysis to drive continuous improvement. Documents technical findings and best practices in reports.

• Develop and maintain equipment used to evaluate silicon and package technologies under simulated field‑use conditions (heat, humidity, temperature cycling, dynamic force).
• Ensure manufacturability of package designs and support manufacturing process flows, procedures, and implementation activities.
• Collaborate with cross‑functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards.
• Support innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency.
• Lead technical problem‑solving and process improvement initiatives using experimental design and statistical analysis methods.
• Provide technical consultation related to packaging and manufacturing process improvements and respond to customer or stakeholder needs as required.
• Partner with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones.
• Develop strong metrology capabilities, operating, programming, troubleshooting, and optimizing automated inspection equipment.
• Utilize software tools to process and analyze inspection images, optimize algorithms, and collaborate with AI experts to improve defect detection while minimizing false positives.
• Perform data analysis to identify patterns, understand input/output relationships, and continuously improve inspection system performance and process capability.
• Partner with suppliers and cross‑functional engineering teams to develop next‑generation inspection and metrology technologies.

• Minimum Qualifications: Bachelor's degree in Engineering, Physics, Chemistry, Materials Science, or related field with 5+ years of engineering industry experience including inspection equipment; or Master's degree with 3+ years of experience; or PhD with 6+ months of experience.
• Preferred Qualifications: Experience with automated inspection tools, image processing algorithms and AI; semiconductor fabrication processes and technology; advanced packaging and/or assembly process experience; equipment selection, integration, ownership, and change control management; project management experience for complex, time‑critical projects; strong technical problem‑solving and innovation skills within manufacturing or engineering environments.

Experienced Hire
• Shift 1 (United States of America)
• Primary

Location:

US, Arizona, Phoenix

We offer a total compensation package that ranks among the best in the industry. It includes competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation. Annual Salary Range: $ – $ USD.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.