Assembly Packaging Technical Integrator - Intel Foundry Services MAG

Role Overview

As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global customer base. This role places you at the intersection of engineering innovation and sustainability, ensuring Intel's products are safely transported while minimizing environmental impact. You will collaborate across diverse teams, including manufacturing, regulatory, logistics, and supply chain, to meet operational goals and drive continuous improvement.

• Design, develop, and qualify packaging solutions and materials that meet product, regulatory, and environmental requirements.
• Lead packaging development efforts, including creating artwork, prototypes, and detailed specifications.
• Collaborate with cross‑functional teams to ensure packaging solutions align with manufacturing, logistics, and supply chain needs.
• Identify and implement cost‑saving measures and processes to enhance efficiency, reduce waste, and promote sustainability.
• Conduct risk analyses to ensure compliance with regulations and Intel's high‑quality standards.
• Partner with cross‑organizational teams on SKUs, labeling, branding, and bills of material for product distribution.
• Evaluate and qualify vendors to ensure scalability and high‑quality manufacturing of packaging solutions.
• Engage with customers and drive programs to satisfy foundry customer needs.
• Create and maintain detailed technical specifications to ensure consistent and clear documentation.

Technical knowledge and firsthand experience are critical for effective integration of cross‑functional efforts, including Assembly Process technology, Package assembly Design Technology, design services, statistical model‑based analysis, and yield and package reliability analysis.

• Strong communication and collaboration skills with the ability to work effectively across internal teams, vendors, customers, and cross‑functional stakeholders.
• Strong analytical and problem‑solving skills.
• Ability to manage multiple priorities in a fast‑paced technical environment.
• Demonstrated ability to research, develop, and drive innovative technical solutions.
• Strong organizational and documentation skills.

Minimum Qualifications:

• Bachelor’s degree in Engineering, Material Science, Physics, Chemistry, or a related technical field.
• 6+ years of experience with a Bachelor’s degree, 2+ years with a Master’s degree, or a Ph.D. with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.

Additional Qualifications for Consideration:

• Knowledge of Design for Manufacturing (DFM) principles.
• Experience with semiconductor packaging assembly and production processes.
• Experience with optical packaging technologies and semiconductor manufacturing environments.
• Experience performing data analysis, statistical analysis, yield analysis, or package reliability analysis.
• Experience working in cross‑functional engineering and manufacturing environments.

Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary

Location:

US, Arizona, Phoenix
Additional Locations: US, Oregon, Hillsboro

Annual Salary Range (US): $ – $ USD.

This role will require an on‑site presence.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Intelis committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Join our team and make an impact on Intel's packaging innovation and sustainability efforts.