Senior Packaging Module Development Engineer

Job Overview

As a Senior Packaging Module Development Engineer, you will play a pivotal role in shaping Intel's product packaging solutions to ensure the safe and efficient transport, display, and delivery of Intel products worldwide. Your expertise will drive innovation and sustainability in packaging design, enabling Intel to meet business objectives while exceeding customer expectations. You will collaborate with cross‑functional teams to contribute directly to Intel’s success, enabling seamless product launches, improving packaging supply chains, and influencing sustainability practices.

• Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
• Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
• Collaborate with manufacturing, logistics, regulatory, and supply‑chain partners to ensure packaging solutions meet operational needs.
• Identify and implement cost‑saving, waste‑reduction, and efficiency improvement measures for packaging processes.
• Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel’s quality standards.
• Consult with cross‑organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel’s distribution channel.
• Evaluate and qualify vendors to ensure high‑quality packaging manufacturing startup and scalability.
• Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
• Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.

• Effective communication skills to collaborate with cross‑organizational teams, external vendors, and customers.
• Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.
• A track record of delivering results in time‑critical technical projects involving innovation and strategic planning.
• Apply problem‑solving techniques and fundamental engineering concepts to create novel, efficient solutions.
• Strong data analysis skills.

• Minimum Qualifications:
  • Master’s degree in Engineering, Physics, Chemistry, or a related STEM field with 4+ years of educational or work experience, or a PhD with 2+ years of experience.
  • Experience in product packaging assembly processes and production methodologies.
  • Knowledge of statistical process control (SPC) principles and design of experiments (DOE) techniques.
  • Analytical skills with proficiency in data analysis and risk assessment methods.
  • Design for manufacturing (DFM) practices and packaging test criteria.
• Preferred Qualifications:
  • Prior experience with solder joint quality assessment.
  • Experience with surface‑mount technologies, solder joint formation/quality/reliability, and package certification methodologies.
  • Passion for engineering excellence and sustainability.

Primary

Location:

US, Arizona, Phoenix

Shift: Shift1 (United States of America)
Work Model:
This role requires on‑site presence. The role may be performed in other locations if needed.

Annual Salary Range:$–USD

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.