Packaging Process Engineer - Microdisplay

Snap Inc ()  is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together. The Company's three core products are Snapchat () , a visual messaging app that enhances your relationships with friends, family, and the world;
Lens Studio () , an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles () .

The Spectacles team is pushing the boundaries of technology to bring people closer together in the real world. Our fifth-generation Spectacles, powered by Snap OS, showcase how standalone, see-through AR glasses make playing, learning, and working better together.

Snap's camera supports real friendships through visual communication, self expression and storytelling. Moving forward, our camera will play a transformative role in how people experience the world around them, combining what they see in the real world, with all that's available to them in the digital world.

We're looking for a Packaging Process Engineer to join our team at Snap Inc!

** What You'll Do:*
* This role will serve as the technical process owner for backend packaging and continuity testing tool, supporting our advanced displays from prototyping through production. As an engineer you would drive process development, yield, and manufacturability on our microdisplay production line.

Additionally you will:

+ Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.

+ Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification, process capability, build readiness, and issue resolution.

+ Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.

+ Lead structured problem solving (DOEs, FMEA, root cause analysis, corrective actions) for yield excursions, line stops, and parametric drifts.

+ Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

** Knowledge, Skills & Abilities:*
* + Hands-on experience with automated packaging equipment, including recipe setup, tuning, and troubleshooting.

+ Proven ability to function as a module owner in a high-volume fab or OSAT environment, balancing NPI design transfer activities and roadmap work.

+ Exceptional problem solver with a structured, solution focused approach, leveraging advanced statistical tools to improve yield and stability in packaging.

+ Comfortable working in an ISO 5 cleanroom environment and enforcing best practices in contamination control, safety, and EHS compliance.

*
* Minimum Qualifications:

*
* + BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field

+ 7+ years of experience as a process or packaging engineer in microfabrication fabs.

+ Direct experience designing and optimizing automated production equipment for semiconductors or displays

+ Direct experience in final test for semiconductor or display packages.

+ Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross-functional problem solving.

+ Experience planning and executing process transfers from R&D to production lines.

+ International travel between Taiwan, U.S., and supplier sites (up to ~10%).

*
* Preferred Qualifications:

*
* + 10+ years of experience in process engineering and backend packaging.

+ Ownership of  module performance and direct collaboration with applications engineers.

+ Excellent problem solver with a foundation in Six Sigma.

+

Experience with automated optical assembly and test equipment.

+ Experience developing and sustaining wire bonding processes (materials, bond parameters, loop profiles, pad design interfaces) for high‑density LOCS packages.

+ Strong expertise in backend assembly processes for advanced displays,…