Senior Technical Solutions Engineer - Advanced Packaging

Overview

Job Details:

Job Description:

About Intel Foundry Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation. As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products.

Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.

The Opportunity Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.

• Customer Relationship Leadership:
  Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
• Voice of the Customer:
  Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
• Technical Consultation & Problem-Solving:
  Partner directly with customers to understand packaging challenges and requirements; provide expert technical consultation on packaging solutions and processes; connect customers with Intel Foundry's technical experts for specialized insights
• Cross-Functional Collaboration:
  
  Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams; influence product and technology roadmaps through customer feedback and market insights; coordinate internal Intel resources to ensure customer success
• Program Management & Execution:
  Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones; manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life; track commitments, action items, and escalations while monitoring risks and dependencies; drive resolution of qualification and delivery issues
• Communication & Reporting:
  Provide clear, regular status reports to customers and leadership; facilitate effective communication between technical and business stakeholders

• Strong communication skills
• Ability to navigate both technical and operational discussions effectively
• Strong problem-solving and analytical thinking capabilities
• Talent for explaining complex technical concepts clearly and concisely

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.

• Minimum Qualifications:
  
  Bachelor s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
• 5+ years of experience in one or more of the following:
  Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
• 8+ years of Semiconductor experience

Preferred Qualifications:

Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field;
Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management;
Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes;
Experience with DOE, FMEA, yield analysis, and failure analysis methodologies;
Project management and customer-facing experience;
Flexibility for travel as needed

• Job Type: Experienced Hire
• Shift: Shift 1 (United States of America)
• Primary
  
  Location:
  
  US, Arizona, Phoenix
• Locations: US, California, Folsom; US, California, Santa Clara; US, Oregon, Hillsboro; US, Texas, Austin
• Business group:
  Intel Foundry

Benefits We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs including health, retirement, and vacation.…