×
Register Here to Apply for Jobs or Post Jobs. X

Physical Failure Analysis Technician

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: FHLB Des Moines
Full Time position
Listed on 2026-06-05
Job specializations:
  • Engineering
    Quality Engineering, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Physical Failure Analysis Technician page is loaded## Physical Failure Analysis Technician locations:
AZ - Chandler time type:
Full time posted on:
Posted Yesterday job requisition :
R1415-26

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our ;

we affectionately refer to it as the
* Aggregate System
* and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over  without a great team dedicated to empowering innovation. People like you.

Visit our  page to see what exciting opportunities and company  await!
*
* Job Description:

** We are seeking an experienced Physical Failure Analysis Technician with 5–10 years of hands-on experience to support semiconductor failure analysis. The ideal candidate will have deep expertise operating a Dual Beam Focused Ion Beam / Scanning Electron Microscope (FIB/SEM) and strong skills in sample preparation techniques to enable accurate root-cause analysis. This role will work closely with failure analysis engineers to analyze physical defects, packaging issues, and structural failures across a variety of device technologies.
** Requirements/

Qualifications:

** Key Responsibilities
* Operate and maintain Dual Beam FIB/SEM
** systems
* * for:  + Site-specific cross-sectioning  + Circuit editing  + TEM lamella preparation  + Defect localization and characterization
* Perform package decapsulation using chemical, mechanical, laser, and plasma-based techniques.
* Execute precision CNC milling for sample exposure and preparation.
* Conduct X-ray analysis (2D/3D) for non-destructive internal inspection.
* Perform C-SAM (Scanning Acoustic Microscopy) for delamination, void, and crack detection.
* Apply additional sample preparation techniques including:  + Mechanical polishing  + ion milling  + Chemical etching  + Plasma cleaning
* Document analysis procedures, findings, and results in detailed technical reports.
* Collaborate with engineering teams to support root cause analysis and corrective action development.
* Maintain lab equipment, follow EHS protocols, and support continuous improvement of FA processes.

Required Qualifications
* 5–10 years of experience in physical failure analysis or related semiconductor/electronics lab environment.
* Expert-level proficiency with Dual Beam FIB/SEM systems
* Strong understanding of semiconductor device structures and electronic packaging.
* Ability to interpret SEM images, cross-sections, and failure signatures.
* Experience with technical documentation and report writing.

Preferred Qualifications
* Associate’s or Bachelor’s degree in Electronics, Materials Science, Mechanical Engineering, or a related technical field.
* Experience with advanced packaging (BGA, QFN, CSP, flip-chip, wafer-level packaging).
* Familiarity with TEM sample preparation and coordination with TEM analysis.
* Hands-on experience with:  + Package decapsulation  + CNC milling  + X-ray inspection  + C-SAM analysis

Work Environment
* Laboratory-based role requiring use of advanced analytical equipment
* May involve handling chemicals and operating precision machinery
* Compliance with EHS standards is required
** Travel Time:
** No Travel
** Physical Attributes:
** Feeling, Handling, Hearing, Seeing, Talking, Works Alone, Works Around Others
*
* Physical Requirements:

** 100% inside, normal business hours

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the .
** To all recruitment agencies**:
* Microchip Technology Inc.
** does not
** accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.
* At Microchip, employees are our greatest strength. As one of the top performing semiconductor companies in the world, we are led by a set of guiding values and a mission to empower innovation to enhance the human experience. We work tirelessly to create a company culture that highlights how important every employee is to our mission.
#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary