Technical Staff Engineer - AMS Verification
Listed on 2026-06-21
-
Engineering
Test Engineer, Systems Engineer, Electronics Engineer, Hardware Engineer
Job Description
The successful candidate will be responsible for system‑level Analog Mixed‑Signal (AMS) verification and Power Integrity (PI/SI) for next‑generation SoCs and chiplet‑based platforms, integrating analog IP in mature nodes with advanced digital nodes (e.g., 12nm and beyond).
Responsibilities- Lead/contribute to sub‑system and chip‑level AMS and SPICE simulations for complex SoCs and multi‑die (chiplet) architectures
- Drive AMS verification across chiplet boundaries, including cross‑node integration (mature analog + 12nm digital)
- Collaborate closely with SoC design, architecture, analog, and advanced‑node digital implementation teams
- Review and understand SoC specifications, IO subsystems, and die‑to‑die interface requirements
- Plan and execute AMS/SPICE simulation strategies, including full‑chip and chiplet‑level verification.
- Perform PI/SI simulations covering:
- Die pad ring
- Package and interposer (chiplet‑based designs)
- PCB interfaces (as applicable)
- Analyze power integrity and signal integrity across chiplet interfaces and multiple power domains
- Develop and enhance AMS and PI/SI methodologies and flows for multi‑die/chiplet systems
- Partner with validation teams on silicon bring‑up, debug, and simulation‑to‑silicon correlation
- Bachelor’s/Master’s degree in electrical engineering or equivalent with 14+ years of experience.
- Proven experience in AMS verification for advanced SoCs, including exposure to 12nm nodes or beyond
- Solid understanding of cross‑domain interactions and multi‑voltage/power domains
- Hands‑on experience with industry‑standard tools:
- Cadence (Virtuoso, Spectre, AMS Designer)
- Questa ADMS / Symphony
- HSPICE or equivalent
- Experience in silicon debug and correlation of simulation results with silicon behavior
- Ability to analyze and interpret chip‑level electrical specifications and IO requirements.
- Strong communication skills with the ability to work effectively in a global, cross‑functional environment
- Experience with chiplet architectures or multi‑die system integration
- Exposure to die‑to‑die interfaces and advanced node (12nm and beyond) integration challenges
- Experience in circuit‑level debug and modeling
0% - 25%
Physical AttributesHearing, Seeing, Talking, Works Alone, Works Around Others
Physical Requirements90% Sitting, 10% Standing/Walking
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