Substrate Packaging Research and Development Engineer

Position

Substrate Packaging Research and Development Engineer – Packaging Technology Development organization at Intel.

Job type:
Experienced Hire;
Shift: Shift 1 (United States of America);
Primary location: US, Arizona, Phoenix

• Develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology roadmap.
• Drive process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies.
• Leverage engineering fundamentals, experimental design, statistical analysis, and problem‑solving skills to develop and qualify new packaging solutions while ensuring quality, reliability, manufacturability, and cost competitiveness.
• Develop assembly processes and/or equipment and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimize and improve the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications applying principles for design of experiments and data analysis, and document improvements through white papers.
• Develop and maintain equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensure manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures and flows.
• Establish material specifications for contract assemblers and raw material vendors and interface with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met.
• Develop new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Set reliability requirements to meet customer needs and influence design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Lead efforts toward innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provide consultation concerning packaging problems and improvements in the packaging process, and respond to customer/client requests or events as they occur.

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree.
• 2+ years of prior experience combining engineering judgment and data analysis skills to draw conclusions, build models, and design experiments.
• Experience in materials science and engineering, and in material characterization techniques.
• Knowledge of design of experiments, statistical data analysis and statistical process control.

• Working knowledge and/or prior experience in optics and lasers, laser micro‑machining and micro‑fabrication.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Annual Salary Range for jobs which could be performed in the US: $- USD

This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.