Hybrid Substrate Packaging R&D Engineer
Job in
Chandler, Maricopa County, Arizona, 85249, USA
Listed on 2026-07-18
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-18
Job specializations:
-
Engineering
Process Engineer, Manufacturing Engineer, Packaging Engineer, Quality Engineering
Job Description & How to Apply Below
Intel Corporation's Packaging Technology Development group seeks a Substrate Packaging Research and Development Engineer in the US. The role centers on developing assembly processes and equipment for future packaging tech, with a hybrid work model in Arizona.
The candidate should have a PhD in a related field and hands-on experience with design of experiments, materials characterization, and statistical analysis to drive process improvements and cost competitiveness.
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