More jobs:
Senior IC Packaging Architect: Chiplet & Power Delivery
Job in
Chandler, Maricopa County, Arizona, 85249, USA
Listed on 2026-07-20
Listing for:
Jobtailor
Full Time
position Listed on 2026-07-20
Job specializations:
-
Engineering
Packaging Engineer
Job Description & How to Apply Below
Jobtailor is seeking an experienced packaging expert to lead end-to-end development of advanced IC packaging solutions. You will design and deliver 2.5D/3D packaging with power-delivery chiplets, integrating them into substrate cores, while coordinating with OSATs and suppliers.
The role covers concept through high-volume manufacturing, with a strong emphasis on DoE, data analysis, and reliability testing. You will apply your expertise in power delivery, SI, and package-system co-design to drive
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×