Senior Thermal-Mechanical Engineer, -Power Packaging

• Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.

• Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.

• Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.

• Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.

• Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.

• Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.

Requirements

• MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field
• 10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems
• Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent
• Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications
• Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling
• Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows

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Hard Skills

• thermal engineering
• thermo-mechanical simulations
• thermal solutions development
• reliability physics
• CTE management
• thermal cycling
• package assembly processes
• substrate manufacturing
• advanced packaging
• high-performance computing systems

Certifications & Qualifications

• MS in Mechanical Engineering
• PhD in Mechanical Engineering
• MS in Thermal Engineering
• PhD in Thermal Engineering
• MS in Materials Science
• PhD in Materials Science