Packaging Equipment Development Engineer — Semiconductors
Job in
Chandler, Maricopa County, Arizona, 85249, USA
Listed on 2026-07-21
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-21
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering
Job Description & How to Apply Below
Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to design and optimize processes and equipment that support the company’s next-generation packaging roadmap. This role directly influences manufacturing efficiency, product reliability, and leadership in the semiconductor industry.
Responsibilities include developing packaging processes, applying DOE/ SPC methods, designing test equipment, and ensuring manufacturability of layouts.
#J-18808-LjbffrTo View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×