ATD MIHL Equipment Development Engineer

Job Overview

Packaging Module Development Engineer – design and optimize innovative processes and equipment to support Intel’s roadmap for next‑generation packaging solutions. The role directly impacts manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.

• Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
• Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
• Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
• Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
• Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
• Lead problem‑solving initiatives and drive continuous improvement in equipment and processes.
• Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
• Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.

• Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 3+ years of relevant experience.
• Or Master’s degree with 2+ years of relevant experience.
• Or PhD with 6+ months of relevant experience.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing.
• Competency in mechanical design software such as Solid Works or AutoCAD.
• Proven ability to lead technical innovation and manage complex, time‑sensitive projects.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with supply chain management in a manufacturing or materials qualification environment.
• Experience with high‑precision manufacturing methods, including stamping and CNC machining.

Annual salary range: $ – $ USD. Salary is based on location and individual qualifications. Stock bonuses and benefit programs, including health, retirement, and vacation, are included.

Primary location:
Phoenix, Arizona, USA. This role requires on‑site presence.

Experienced Hire. Shift 1 (United States of America).

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.