Packaging Process Engineer – Microdisplay

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together. The Company’s three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world;
Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles.

• Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
• Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification, process capability, build readiness, and issue resolution.
• Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
• Lead structured problem solving (DOEs, FMEA, root cause analysis, corrective actions) for yield excursions, line stops, and parametric drifts.
• Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

Hands‑on experience with automated packaging equipment, including recipe setup, tuning, and troubleshooting; proven ability to function as a module owner in a high-volume fab or OSAT environment, balancing NPI design transfer activities and roadmap work; exceptional problem solver with a structured, solution‑focused approach, leveraging advanced statistical tools to improve yield and stability in packaging; comfortable working in an ISO 5 cleanroom environment and enforcing best practices in contamination control, safety, and EHS compliance.

• BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field.
• 7+ years of experience as a process or packaging engineer in microfabrication fabs.
• Direct experience designing and optimizing automated production equipment for semiconductors or displays.
• Direct experience in final test for semiconductor or display packages.
• Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross‑functional problem solving.
• Experience planning and executing process transfers from R&D to production lines.
• International travel between Taiwan, U.S., and supplier sites (up to ~10%).

• 10+ years of experience in process engineering and backend packaging.
• Ownership of module performance and direct collaboration with applications engineers.
• Excellent problem solver with a foundation in Six Sigma.
• Experience with automated optical assembly and test equipment.
• Experience developing and sustaining wire bonding processes (materials, bond parameters, loop profiles, pad design interfaces) for high‑density LOCS packages.
• Strong expertise in backend assembly processes for advanced displays, including die attach, marking, and final packing.

If you have a disability or special need that requires accommodation, please don’t be shy and provide us some information.

Snap Inc. is proud to be an equal opportunity employer, and committed to providing employment opportunities regardless of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, pregnancy, childbirth and breastfeeding, age, sexual orientation, military or veteran status, or any other protected classification, in accordance with applicable federal, state, and local laws.

EOE, including disability/vets. We are an Equal Opportunity Employer and will consider qualified applicants with criminal histories in a manner consistent with applicable law (by example, the requirements of the San Francisco Fair Chance Ordinance and the Los Angeles Fair Chance Initiative for Hiring, where applicable).

Paying parental leave, comprehensive medical coverage, emotional and mental health support programs, and compensation packages that let you share in Snap’s long‑term success! The benefits are built around your needs and include paid parental leave, comprehensive medical coverage, emotional and mental health support programs, and compensation packages that let you share in Snap’s long‑term success!

• Zone A (CA, WA, NYC):
  The base salary range for this position is $142,000-$214,000 annually.
• Zone B:
  The base salary range for this position is $135,000-$203,000 annually.
• Zone C:
  The base salary range for this position is $121,000-$182,000 annually.
• This position is eligible for equity in the form of RSUs.