Laser Packaging Development Engineer - DOE & SPC
Job in
Chandler, Maricopa County, Arizona, 85249, USA
Listed on 2026-09-07
Listing for:
Intel Corporation
Full Time
position Listed on 2026-09-07
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer, Quality Engineering, Process Engineer -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Intel Corporation in Arizona seeks a Packaging Module Development Engineer in Laser Assembly to shape the future of semiconductor packaging technologies. You will contribute to development of processes and equipment that ensure high performance and reliability across Intel's assembly and packaging solutions.
Collaborate with cross-functional teams to design laser assembly packaging processes, optimize manufacturing, set DOE-based specs, and drive standardization in qualification and quality
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