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Technician II PCB Assembly Lab

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: Microchip Technology Inc.
Full Time position
Listed on 2026-02-21
Job specializations:
  • Manufacturing / Production
    Manufacturing Engineer, Electronics Technician, Quality Engineering
  • Engineering
    Manufacturing Engineer, Electronics Technician, Quality Engineering
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Technician II-Package & PCB Assembly Lab

Overview

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi‑billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally‑recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually.

We take pride in our commitment to employee development, values‑based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo;

we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Job Description

As a Technician II in the Package & PCB Assembly Lab, your primary duties will include, but are not limited to:

  • Learning the engineering package assembly processes from wafer cutting, die attachment, and wire bonding.
  • Interaction with and supporting the hardware engineering teams, other internal customers and external suppliers.
  • Trouble shooting and diagnosing processes and equipment related problems.
  • Develop new processes that will expand lab capabilities.
  • Generating and maintaining project build requests/reports, managing component inventory, reviewing/vetting “bills of materials”, and building mechanical assemblies to support engineering projects.
  • Provide back‑up support to other areas of the Assembly lab as required.
  • Maintain lab documentation, inventory tracking/ordering, data entry, and build requests verification.
  • Responsible for troubleshooting design development and production problems.
  • Good decision making and communication skills.
  • Organized and meticulous regarding data collection and test execution.
  • Strong multi‑tasking skills and adapting to changing priorities are critical for this position.
  • Individual should be a self‑starter, versatile, problem solver, and have a willingness to work as part of a team.

The duties for this job can vary and will be primarily driven by customer demand.

Eventually Learning
  • PCB Assembly process such as hand soldering surface‑mount components on circuit boards with a high level of precision, PCB build kit audits, maintenance scheduling, and shipping forms. Handle electrical test / verification and equipment set‑up.
  • Maintain lab documentation, AX/Inventory tracking/ordering, data entry, build requests verification.
Physical Requirements
  • Ability to stoop, kneel, crouch, reach, walk, push, pull and grasp.
  • Ability to exert up to 30 pounds of force occasionally, and/or up to 10 pounds of force frequently, and/or a negligible amount of force constantly to move objects.
  • Hand‑eye coordination as well as hand dexterity.
  • Required to wear personal protective equipment where applicable.
  • Subject to frequent interruptions.
  • Ability to stand/sit for sustained periods of time.
Requirements / Qualifications
  • High School Diploma or equivalent.
  • Proficient with MS Office products including Excel and Word.
  • Some technician coursework and/or 2 to 3 years semiconductor wafer dicing, wire bonding and/or assembly experience.

U.S. Export Controls Requirements:
This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Travel

No Travel

Pay Range

We offer a total compensation package that ranks among the best…

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