Module Equipment Technician

As a Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production. Your contributions will directly impact Intel's innovation, enabling the delivery of advanced technologies that power the future of computing. This is an exciting opportunity to grow your technical expertise, work alongside engineering teams, and be part of a collaborative environment where your skills make a tangible difference.

This role has openings available in all functional areas, Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. This role has opportunities across all shifts (4/5/6/7) as needed per functional area. The Module Equipment Technician will be responsible for but not limited to:
Perform functions associated with all wafer production including operations, equipment, process and training. Equipment maintenance and repair, equipment troubleshooting, defect reduction, and other duties as required supporting Fab objectives. Work from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication.

Shift details:
This position is for a compressed work week schedule with availability on all shifts in Ocotillo Technology Fabrication (Fab
52/42/32/12). The ideal candidate must be willing and able to work a compressed work week consisting of three consecutive 12-hour shifts, followed by a four-day work week every other week. Shift 4 – Night front half of week – PM-AM Sun-Tues and alternating Saturday nights;
Shift 5 – Days front half of week – AM-PM Sun-Tues and alternating Wednesday days;
Shift 6 – Night back half of week – PM-AM Wed-Sat and alternating Saturday night;
Shift 7 – Days back half of week – AM-PM Thurs-Sat and alternating Wednesday days. Must be willing to perform work in a cleanroom environment while wearing required PPE, including coveralls, hood, booties, safety glasses, gloves, and respirator (when required). Must be willing to lift up to 35 pounds (18 kgs) 4 times a day. Position requires frequent standing, walking, bending, and reaching.

• Perform functions associated with all wafer production including operations, equipment, process and training.
• Equipment maintenance and repair, equipment troubleshooting, defect reduction, and other duties as required supporting Fab objectives.
• Work from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication.

• BS STEM related to Semi. Mfg (MET) / BS STEM (operator) – Should be a TG req with BS STEM and no experience
• HS/GED or higher non-semi degree AND 4+ years related (1) hands on experience OR military technical experience
• HS/GED or higher non-semi degree AND 2.5+ years in related (1) equipment maintenance experience
• HS/GED or higher non-semi degree AND 3+ year Technical/trade certification OR 3+ years technical experience
• Associate degree STEM Related to semi. Mfg. (MET) / STEM (operator) AND 2+ years related equipment maintenance experience.

• Military experience
• Advanced Node Semiconductor manufacturing experience in a production environment.
• Experience performing hands-on preventative, corrective maintenance on 300mm semiconductor equipment (or equivalent experience).
• Demonstrated skills to influence the content and creation of new specs, procedures and business processes related to equipment maintenance.
• Knowledge of process control systems.
• Experience with schematics and complex drawings/diagrams.
• Integrated circuit fabrication experience.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $60,.00 USD (Hourly Role) The range displayed on this job posting reflects the minimum and maximum target compensation for the…