Electronics Parts, Materials, and Processes Engineer - Advanced Packaging

The Aerospace Corporation is the trusted partner to the nation's space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space- delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you'll be part of a special collection of problem solvers, thought leaders, and innovators.

Join us and take your place in space.

At the Mission Payloads Division (MPD), we are pioneers in remote sensing systems that guide our country's space enterprise. Our talented and dynamic people create and flourish in electronics, sensors, radar, artificial intelligence (AI), and advanced data network domains. We boldly advance technology through our research and development and then forward to demonstration and integration. With innovative laboratories and prototyping, MPD delivers groundbreaking results.

We guide our Department of Defense, intelligence community, and civil clients to enhance national productivity and security and tackle the most critical missions. Bring your intelligence and creative spirit and join us at MPD!

The Parts, Materials & Processes Department (PMPD) includes subject matter experts across a broad range of areas pertaining to electrical, electronic, and electromechanical (EEE) parts procurement, qualification, application, root cause failure analysis, as well as materials and processes. Our expertise combined with a sophisticated in-house electronic component laboratory deliver innovative analysis and PM&P program management capabilities to national space systems and civil customers.

PMPD is seeking an Electronics Parts, Materials, and Processes Engineer - Advanced Packaging (Engineering Specialist - Microelectronics / Semiconductor Engineering) with proficiency in packaging, assembly, and testing, related procurement standards, related control boards for program management and adjudication of nonconformities.

This position is based in El Segundo, CA and requires a minimum of four days per week in office.

What You'll Be Doing

* Supporting parts, materials, and processes (PM&P) program management functions which include - PM&P selection commensurate with application risk tolerance, control boards, design reviews, and manufacturing readiness reviews

* Provide ongoing technical consultation and advice to management, internal/external customers, and contractors on the evaluation, selection, and use of advanced semiconductor packaging (e.g., 2.5/3D, system in package, multi-chip module) for space and missile applications

* May lead cross-organizational teams and organize interfaces within department

* Collaborate with industry colleagues, and component supplier personnel to create/maintain guidance and requirements related to selection, screening, qualification, and root cause failure analysis

* Act as organization's designated representative at technical meetings, presentation, and workshops

* Mentor less experienced staff - as required - and serve as role model

What You Need to be Successful

Minimum Requirements:

* Bachelor's degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline

* At least eight years of increasingly responsible and related engineering/scientific experience (time spent obtaining advanced degree counts towards this).

* Proficiency in industry PMP requirements standards development for advanced semiconductor packaging - including related, component selection, assembly materials, and processes (PMP), and selection of elements

* Experience supporting parts, materials, and processes (PM&P) program management functions which include -- control boards, design reviews, and manufacturing readiness reviews

* Excellent record of customer communication and interaction

* Willingness to travel [domestically/internationally] approx. 25% of time

* This position requires ability to obtain and maintain a TS/SSBI security clearance, which is issued by the US government. U.S citizenship is required to obtain a security clearance.

How You Can Stand Out

It would be impressive if you have one or more of these:

* Advanced degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline

* 8+ years of experience in advanced semiconductor packaging (time spent obtaining advanced degree counts towards this).

* Experience leading/managing teams to evaluate, select, and qualify electronic parts, materials, and processes (PMP) for space-related applications while balancing risks

* Demonstrated ability to assess non-MIL PRF parts and develop appropriate methods for use in space and related high-reliability applications

* Hold an active TS/SSBI security clearance

* Proficiency in common root cause analysis tools during problem resolution

* Experience collaborating with…