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Microelectronics Assembler​/Wire Bonder

Job in Chelmsford, Middlesex County, Massachusetts, 01824, USA
Listing for: Trispoke Managed Services Pvt Ltd
Full Time position
Listed on 2026-06-02
Job specializations:
  • Manufacturing / Production
    Electronics Technician, Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 26 - 28 USD Hourly USD 26.00 28.00 HOUR
Job Description & How to Apply Below
Title: Assembler
Job : 17926-1
Location : Chelmsford, MA
Pay: $28.00/hr. on W2
Duration : 06 months contract
Citizenship Requirement: US Citizens

Microelectronics Wire Bonder
Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.

Job Details:



Location:

Chelmsford, MA

• Shift: First Shift, Full-Time (M-TH) 6:00 AM - 4:30 PM

• Starting Salary: $26.00 - $28.00/hour



Hours:

6:00 AM - 4:30 PM Monday through Thursday, with possibility for Overtime

What You'll Do:

• Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.

• Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.

• Read and interpret assembly process/work instructions and work instruction processes.

• Work with microscopic to large components that may require visual magnification for entire shift.

• Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).

• Maintain accurate data entry related to production processes.

• Collaborate with teams members to improve throughput and continuous improvement.

What We're Looking For:

• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.

• Familiarity with manual bonding equipment and with automatic bonding equipment.

• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.

• Strong attention to detail and ability to work in a fast-paced environment.

• Ability to follow written and verbal instructions.

• Ability to learn J-STD-001 and/or IPC-A-610.

• Knowledge of ESD procedures and test equipment.

Strong work ethic and a reputation for punctuality and reliability, with a desire to grow and learn in their role.

• High school diploma or GED required.
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