Assembler - Wire Bonder - 2nd Shift

Standard Job Description

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wire bonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement.

Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feed through pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wire bonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement.

Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feed through pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.

As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wire bonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.

We offer a purpose‑driven environment where your expertise directly contributes to mission‑critical technology. You’ll work alongside skilled professionals and have access to a comprehensive benefits package.

This position is in Chelmsford. Discover more about our Chelmsford, Massachusetts location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance. A company‑sponsored interim Secret clearance is required to start.

• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
• Good dexterity and eye/hand coordination
• Experience in wire bonding and/or ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)
• Experience in microelectronics assembly (chip and wire assembly)
• Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
• Ability to work in a team environment; good interpersonal, team and communication skills
• Ability to obtain and maintain a Secret Security…