IC Layout Engineer 5D/3D-IC Expert
Listed on 2026-09-30
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Engineering
Packaging Engineer, Systems Engineer
Annapurna Labs Ltd. in the United States is seeking a Package Layout Design Engineer to advance the physical design of advanced IC packages for data center GPUs and ML accelerators.
You will lead die floor planning, RDL routing, and interposer packaging strategies, collaborating with ASIC teams, SI/PI, thermal, and manufacturing to deliver production-ready designs that meet performance, density, and reliability targets.
This posting is for the IC Package Layout Engineer — 2.5D/3D-IC Expert role at Amazon Web Services (AWS), based in IL, United States.
We are looking to fill the IC Package Layout Engineer — 2.5D/3D-IC Expert position at Amazon Web Services (AWS) in IL, United States.
The IC Package Layout Engineer — 2.5D/3D-IC Expert role at Amazon Web Services (AWS) is now open for applications in IL, United States.
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