Mechanical Architect - Rack, System and Enclosure Design

Mechanical Architect

We are seeking a highly skilled Mechanical Architect to lead the design and development of innovative rack, system, and enclosure solutions. This role involves defining mechanical architectures, ensuring product integrity, and driving design excellence from concept to production.

Job Responsibilities

• Lead the conceptualization, design, and development of mechanical architectures for rack systems, server enclosures, storage solutions, and other IT infrastructure products.
• Define and document mechanical specifications, design requirements, and performance criteria for new products and product enhancements.
• Conduct feasibility studies, trade-off analyses, and risk assessments for various mechanical design approaches.
• Perform detailed mechanical design, material selection, and analysis using CAD software (e.g., Solid Works, Creo) and FEA tools.
• Collaborate closely with electrical, thermal, manufacturing, and supply chain teams to ensure design manufacturability, assembly, and serviceability.
• Develop and execute design verification and validation plans, including prototyping, testing, and troubleshooting.
• Drive continuous improvement initiatives for mechanical design processes, tools, and methodologies.
• Stay abreast of industry trends, new technologies, and competitive offerings in mechanical design for IT hardware.
• Provide technical guidance and mentorship to junior mechanical engineers.
• Manage project timelines and deliverables for mechanical design activities.

Job Qualifications

• Bachelor's or Master's degree in Mechanical Engineering or a related field.
• 10+ years of progressive experience in mechanical design and architecture, with a strong focus on rack systems, server enclosures, or similar IT hardware.
• Expert-level proficiency in 3D CAD software (e.g., Solid Works, Creo, CATIA) and PDM/PLM systems.
• Demonstrated experience with DFM (Design for Manufacturing), DFA (Design for Assembly), and DFC (Design for Cost) principles.
• Strong understanding of thermal management principles and design for cooling in electronic enclosures.
• Experience with sheet metal fabrication, injection molding, casting, and other relevant manufacturing processes.
• Proficiency in performing structural analysis (FEA) and interpreting results.
• Knowledge of relevant industry standards (e.g., EIA, UL, IEC) for IT equipment.
• Excellent problem-solving, analytical, and communication skills.
• Ability to work effectively in a cross-functional team environment.
• Proven ability to lead design projects and manage technical deliverables.

Compensation $160K to $ 202K DOE

@ HYVE Solutions, we believe employees are our greatest asset and we empower them to make a difference in our business. Diversity and inclusion make us all better. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.