Quality Process Engineer - Semiconductor Manufacturing

Location:

Colorado Springs (Onsite)

Our Team:

Semtech Corporation (NASDAQ:

SMTC; ) is a leading supplier of high-quality semiconductor products. Semtech's Analog Mixed Signal and Wireless (AMW) Business Unit develops a broad portfolio of high-performance semiconductor solutions that power, protect, and connect modern electronics. The group's products span circuit protection devices that shield sensitive systems from voltage spikes and electrical overstress, RF solutions serving industrial, medical, and communications applications, advanced power management ICs including switching regulators and wireless charging solutions, and specialized sensing technologies.

AMW's innovations are embedded across some of the fastest-growing markets today - from mobile and consumer devices to industrial automation, medical equipment, and connected infrastructure - making it a critical driver of Semtech's mission to make the world safer, more productive, and more sustainable.

The Quality team at our Colorado Springs backend assembly site manages ISO 9001 certification and IATF 16949 transition, supporting chip-scale packaging operations including flip chip, wafer-level CSP, die attach, molding, and plating processes. We handle internal and external audits, process characterization, document control, and calibration - supporting two manufacturing sites and more than 1,000 controlled documents.

Job Summary:

We are seeking an experienced Quality Process Engineer with chip-scale packaging (CSP) expertise to drive corrective action closure and technical problem-solving across our Colorado Springs backend assembly operations. This role sits at the intersection of quality engineering and process engineering - combining deep technical knowledge of semiconductor packaging with structured problem-solving to eliminate chronic open corrective actions.

You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations, maintenance, and systems engineering teams to diagnose recurring issues and deliver durable solutions. Your technical credibility in semiconductor packaging will enable you to influence cross-functional teams, facilitate collaborative problem-solving sessions, and ensure corrective actions address true root causes rather than symptoms.

Over time, this role may also contribute to quality system auditing as the team scales. If you thrive on applying deep technical knowledge to untangle complex manufacturing problems, influencing engineering teams through data-driven persuasion, and bringing order to ambiguity, this is your role.

Responsibilities:

Corrective Action Leadership (50%)

* Own and drive closure of 70+ open corrective action reports (CARs) across engineering, operations, maintenance, and systems engineering through technical problem-solving and cross-functional collaboration

* Lead cross-functional CAR review sessions, bringing together relevant stakeholders to solve problems comprehensively rather than superficially

* Apply 8D methodology, 5-Why, fishbone, and fault tree analysis combined with CSP technical knowledge to identify true root causes in packaging processes

* Design and execute Design of Experiments (DOE) to identify root causes of process variability and validate corrective actions

* Track CAR closure progress and provide regular status reporting to Quality Director and site leadership

* Verify effectiveness of implemented corrective actions through statistical analysis and follow-up validation

* Identify systemic patterns across open CARs to prioritize high-impact interventions and prevent recurrence

Chip-Scale Packaging & Process Quality (40%)

* Support qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operations

* Investigate and resolve quality issues related to packaging processes including solder joint integrity, die cracking, underfill defects, warpage, and assembly yield

* Apply Statistical Process Control (SPC) methodologies to monitor critical process parameters and process capability…