R&D Hardware Design Manager

Position Overview

We have an exciting opportunity for a highly motivated R&D Hardware Design Manager to lead our ASIC Packaging, Subsystem, and Integration team. In this role, you will lead the design and integration of high‑performance integrated circuit packaging and subsystem solutions for the world’s highest performance test and measurement products.

The position is located in our office in Colorado Springs, Colorado.

• Management of ASIC Package/Subsystem development and system integration including package design and layout, PCB implementation, RF and high-speed digital design, signal integrity modeling, power integrity analysis, and thermostructural analysis.
• Close collaboration with system, IC design and test teams to drive hardware architecture, requirements, functionality, and performance.
• Identification of appropriate technology solutions for each chip design.
• Delivery of electrical models to optimize the IC, package, and system interconnect performance.
• Support for instrument development to enable hardware deployment and integration of critical ASIC blocks.
• Investigation of next‑generation technologies and industry solutions.
• Collaboration with supply chain partners throughout the ASIC development cycle.
• Work closely with internal and external manufacturing partners to identify, develop, deploy, and execute new processes.
• Partner with the reliability team in the characterization and qualification of each ASIC.

• BS or MS degree in a relevant Engineering discipline.
• Minimum 8+ years of experience in hardware/circuit design, RF/microwave design, high‑frequency modeling/optimization, or high‑power density design.
• Minimum 5 years of experience managing/leading multi‑disciplinary development teams.
• Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies.
• Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high‑frequency circuit design methodologies.
• Strong knowledge of thermodynamics and thermostructural analysis principles.
• Excellent understanding of materials science principles.
• Familiarity with IC design methodologies, processes, and workflows preferred.

Candidates must be local or willing to relocate to Colorado Springs, CO.

This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. For non‑U.S. persons, employment is contingent on Keysight’s ability to obtain any required government authorizations.

Keysight Technologies Inc. is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.

Pay Range: USD MIN $151,800 -  $202,400 - MAX $253,000 per year (pay varies by region).

This role is eligible for Keysight Results Bonus Program.

US employees may be eligible for the following benefits:

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units

Visa Sponsorship is unavailable for this position.