Quality Process Engineer - Semiconductor Manufacturing

Quality Process Engineer

Location:

Colorado Springs (Onsite)

Semtech Corporation is a leading supplier of high-quality semiconductor products. Semtech's Analog Mixed Signal and Wireless (AMW) Business Unit develops a broad portfolio of high-performance semiconductor solutions that power, protect, and connect modern electronics.

The Quality team at our Colorado Springs backend assembly site manages ISO 9001 certification and IATF 16949 transition, supporting chip-scale packaging operations including flip chip, wafer-level CSP, die attach, molding, and plating processes.

Job Summary:

We are seeking an experienced Quality Process Engineer with chip-scale packaging (CSP) expertise to drive corrective action closure and technical problem-solving across our Colorado Springs backend assembly operations. This role sits at the intersection of quality engineering and process engineering — combining deep technical knowledge of semiconductor packaging with structured problem-solving to eliminate chronic open corrective actions.

Responsibilities:

Corrective Action Leadership (50%)

• Own and drive closure of 70+ open corrective action reports (CARs) across engineering, operations, maintenance, and systems engineering through technical problem-solving and cross-functional collaboration
• Lead cross-functional CAR review sessions, bringing together relevant stakeholders to solve problems comprehensively rather than superficially
• Apply 8D methodology, 5-Why, fishbone, and fault tree analysis combined with CSP technical knowledge to identify true root causes in packaging processes
• Design and execute Design of Experiments (DOE) to identify root causes of process variability and validate corrective actions
• Track CAR closure progress and provide regular status reporting to Quality Director and site leadership
• Verify effectiveness of implemented corrective actions through statistical analysis and follow-up validation
• Identify systemic patterns across open CARs to prioritize high-impact interventions and prevent recurrence

Chip-Scale Packaging & Process Quality (40%)

• Support qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operations
• Investigate and resolve quality issues related to packaging processes including solder joint integrity, die cracking, underfill defects, warpage, and assembly yield
• Apply Statistical Process Control (SPC) methodologies to monitor critical process parameters and process capability (Cpk/Ppk) for packaging operations
• Perform Measurement System Analysis (MSA) and Gage R&R studies to validate inspection and test equipment capability
• Support new product introduction (NPI) through process validation (IQ/OQ/PQ), first article inspection (FAI), and production readiness activities
• Develop and maintain Process FMEAs (pFMEA), Control Plans, and process documentation for packaging operations
• Conduct device characterization and reliability testing to support process optimization and validation

Quality Systems & Supplier Quality (10%)

• Support maintenance of ISO 9001 quality management system; contribute to IATF 16949 automotive standards transition
• Participate in internal and external audits as technical subject matter expert; audit ownership capability is a plus
• Review and approve quality documentation including procedures, work instructions, and process specifications
• Manage supplier non-conformances (SCARs) and corrective action follow-through as needed

Minimum Qualifications:

• Bachelor's degree in Engineering, Materials Science, Physics, or related technical field
• 5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packaging
• Direct hands-on experience with chip-scale packaging technologies including flip chip, wafer-level CSP, or advanced packaging processes
• Demonstrated expertise in 8D methodology, root cause analysis (5-Why, fishbone, fault tree), and structured problem-solving
• Strong statistical analysis skills including SPC, process capability (Cpk/Ppk), hypothesis testing, and Design of Experiments (DOE)
• Working knowledge of AIAG Core Tools: PFMEA, Control Plans, MSA, PPAP, and APQP
• Experience with ISO 9001 or equivalent quality management systems
• Proficiency with statistical analysis software (Minitab, JMP, or equivalent) and Microsoft Office suite
• Excellent written and verbal communication skills with ability to influence across organizational levels
• Proven track record of building collaborative relationships with engineering, manufacturing, and supplier organizations

Desired

Qualifications:

• Master's degree in Materials Science, Engineering, or related technical field
• Six Sigma Green Belt or Black Belt certification
• Certified Quality Engineer (CQE) or Certified Quality Auditor (CQA) from ASQ
• ISO 9001 or IATF 16949 Lead Auditor certification
• Experience with wafer fabrication processes (etch, PVD, lithography, thin films) to support packaging integration
• Direct experience with flip chip bumping, redistribution layer (RDL)…