ElectroMechanical Packaging Engineer IV, Circuit Card Packaging

Electro Mechanical Packaging Engineer IV, Circuit Card Packaging | Lockheed Martin

The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use.

Location:

This position does not support teleworking; you will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.

What does this role look like?

• Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations.

• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.

• Support manufacturing and test disciplines in minimizing cycle time and resolving problems.

• Establish specifications for contract assemblers and raw-material vendors.

• Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.

• Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.

• Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

Key activities you will accomplish in this role:

• Identify initial physical architecture for the Avionics subsystem.

• Conduct R&D trade studies for Pre-SRR design phase.

• Define the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.

• Generate and release design disclosure artifacts including technical presentations and end of year reports.

• Work on a cross-functional team in the development and integration of world class avionics systems.

• Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.

• Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required.

• Resolve test anomalies and support system level testing.

To be effective in this role, you will need:

• Experience with circuit card enclosure design.

• 5+ years professional experience.

• While no clearance is needed to start in this position, you will need to obtain and maintain a DoD Top Secret clearance, thus US Citizenship is required.

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