Chief Packaging Engineer

Chief Packaging Engineer

Brooklyn Park, MN or Broomfield, CO (remote up to 2 days per week with approval)

We are seeking a highly qualified Chief Packaging Engineer in Brooklyn Park, MN or Broomfield, CO location. In this role you will work closely with a team of physicists, engineers, and technicians, as well as with our external partners, to help define and execute the architecture for all aspects of advanced packaging for our next generation of ion traps and related components.

This influential position will balance technical leadership, individual technical contribution, and external vendor partnership to create and own the packaging roadmap. A successful candidate will have a broad and deep understanding of microelectronic and photonic packaging techniques for mechanical, thermal, electrical, and photonic interfaces.

• Define, develop, and drive an advanced packaging architecture for our next generation of ion traps with complex optical, electrical and mechanical interfaces
• Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density
• Define and oversee short loops that will elucidate packaging requirements for mechanical, thermal, electrical, and optical performance
• Work with vendors to implement and validate packaging processes
• Support all stages of ion trap development to ensure compatibility with packaging
• Provide technical guidance to a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements and is manufacturable
• Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities

• Minimum Bachelor’s degree with 18+ years’ experience in advanced semiconductor packaging development
• Minimum Master’s degree with 15+ years’ experience in advanced semiconductor packaging development
• Minimum PhD with 12+ years’ experience in advanced semiconductor packaging development
• Due to Contractual requirements, must be a U.S. Person (U.S. citizen, permanent resident or green card holder, workers granted asylum or refugee status)
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

• PhD in Physics or Engineering
• Experience with advanced large area multi-chip semiconductor packaging technologies
• Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling
• Experience with large heterogeneous integration and 2.5-3D packaging techniques
• Experience with high-density I/O technologies
• A proven track record of innovation and IP development
• Experience working within a cross-functional team environment

$208,000 - $260,000 a year.

Incentive Eligible – Range posted is inclusive of bonus target.

The pay range for this role is $208,000 – $260,000 annually. Actual compensation within this range may vary based on the candidate’s skills, educational background, professional experience, and unique qualifications for the role.

• A competitive salary and innovative, game-changing work
• Flexible work schedule
• Employer subsidized health, dental, and vision insurance
• 401(k) match for student loan repayment benefit
• Equity, 401k retirement savings plan + 12 Paid holidays and generous vacation + sick time
• Paid parental leave
• Employee discounts

Quantinuum is an equal opportunity employer. You will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectionate or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.

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