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Product Marketing Manager

Job in Coos Bay, Coos County, Oregon, 97458, USA
Listing for: Onto Innovation
Full Time position
Listed on 2026-02-07
Job specializations:
  • Engineering
    Materials Engineer, Electrical Engineering
Job Description & How to Apply Below
Position: Product Marketing Manager 3

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues.

Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.

Job Summary & Responsibilities

You will lead product marketing for Onto Innovation’s FAaST® CV/IV, CnCV®, and MBIR (Model‑Based Infrared Reflectometry) product lines—Semilab’s flagship metrology platforms now part of Onto’s portfolio—serving advanced logic/memory, advanced packaging (including AI‑enabling flows), and power semiconductor segments.

You’ll build compelling positioning and go‑to‑market programs that highlight non‑contact electrical characterization, wide bandgap (SiC/GaN) interface metrology, and high‑aspect‑ratio 3D structure control to drive fab adoption and measurable yield/COO impact.

Why This Role Matters

FAaST delivers non‑contact CV/IV metrology using patented corona‑Kelvin methods to quantify dielectric and interface properties—enabling fast, device‑free feedback on EOT, leakage, flatband voltage, traps (Dit), mobile ions, and plasma damage/NVD mapping.

CnCV® extends non‑contact CV into wide bandgap materials with photo‑assisted techniques for deep interface traps and robust dopant profiling—reducing test cost and time while improving process control for SiC/GaN and HEMT structures.

MBIR enables high‑throughput, non‑destructive IR reflectometry to control 3D‑etched structures (trenches, TSVs, capacitors), film thickness/composition, and epitaxial layers—even at small spot size suitable for scribe lines.

Together, these tools strengthen Onto’s materials characterization suite and complement defect/OCD capabilities across growth segments.

Key Responsibilities

Market & Competitive Strategy

Map the competitive landscape and positioning of FAaST®, CnCV®, and MBIR across electrical metrology and optical IR reflectometry for front‑end, middle‑of‑line, and advanced packaging process steps.

Quantify ROI tied to yield, cycle‑time, and cost‑of‑ownership improvements in advanced logic/memory, AI‑oriented packaging, and power devices; build segment playbooks by node and device class.

Product Positioning & Messaging

Develop differentiation that spotlights FAaST’s non‑contact dielectric/interface electrical metrics, CnCV’s WBG interface/deep‑trap characterization & dopant profiling, and MBIR’s 3D geometry/film stack modeling advantages.

Craft sector‑specific messaging for SiC/GaN, wafer bumping/advanced packaging, and high‑aspect‑ratio memory/logic features, emphasizing device‑free monitoring and scribe‑line control.

Go ‑to ‑Market Planning

Drive launches with webinars, technical briefs, sales training, and targeted campaigns that translate metrology outputs into fab‑level outcomes (yield, throughput, COO).

Equip field teams to articulate how non‑contact electrical metrology (FAaST/CnCV) and IR reflectometry (MBIR) accelerate ramp, qualify new materials, and de‑risk advanced packaging flows.

Sales Enablement & Field Support

Build data‑driven toolkits: FAaST CV/IV/NVD maps;
CnCV QUAD/defect imaging and doping depth profiles for WBG; MBIR trench/film thickness maps and model recipes.

Provide ROI calculators and application playbooks for contamination monitoring (DSPV/FAaST), interface reliability (BTS via CnCV), and 3D‑structure control (MBIR).

Coordinate participation at SEMICON and fab‑focused panels to showcase competitive advantages and customer case studies.

Cross ‑functional Collaboration

Align with R&D/Product Management to feed market insights into roadmap priorities (e.g., CnCV kinetic/UV‑assisted modes; MBIR model libraries).

Partner with Marketing Communications to deliver thought leadership—application notes,…

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