Product Introduction Process​/Tooling Engineer

Overview

This Process and Tooling Engineering position is within HP’s liquid cooling solutions business in the Microfluidic Technology Organization (MTO). This role supports both R&D prototyping and production processes, working as a key NPI engineer within a worldwide team of R&D and manufacturing engineers.

• Understand customer (product) and manufacturing (process) requirements.
• Design engineering solutions for mechanical, electrical, and electronic parts, subsystems, integrated circuitry, and algorithms based on engineering fundamentals.
• Develop and implement new tooling designs, process parameters, and test plans for new and existing products, including validation of tolerances, form/fit/function, shock, vibration, electromagnetic interference, safety, reliability, thermal generation, and system power measurements.
• Lead initiatives to solve issues or reduce risks caused by new technologies or processes.
• Collaborate and communicate with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.
• Lead project teams of other engineers and development partners to develop reliable, cost‑effective, and high‑quality solutions.
• Lead teams that drive root‑cause evaluation and issue resolution as problems arise in prototype and production.
• Assist with Design for Manufacturability (DFM) and Development Effectiveness to reduce risk at the launch of new products.
• Provide guidance and mentoring to less‑experienced staff members.

Education: Bachelor's or Master’s degree in Mechanical, Electrical, Chemical or Materials Engineering.

Experience: 10+ years in product or process development or production environment.

Desired: Experience in complex printed circuit board or GPU board manufacturing.

• Proficiency with design tools and software packages.
• Strong analytical and problem‑solving skills.
• Experience designing mechanical tooling and associated algorithms.
• Use of empirical analysis, modeling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management.
• Knowledge of issue resolution methods (e.g., 8D, CLCA) and ability to implement them.
• Ability to contribute in a fast‑paced, industrial R&D environment.
• Excellent communication, teamwork, planning, organizational, and documentation skills.
• Strong presentation skills to inform and persuade peers and managers.

The pay range for this role is $116,150 to $182,400 USD annually, with additional opportunities for bonus and/or equity (U.S. candidates only). Pay varies by work location, job‑related knowledge, skills, and experience.

HP offers a comprehensive benefits package, including Health, Dental, Vision, Long‑term/Short‑term Disability, Employee Assistance Program, Flexible Spending Account, Life Insurance, Generous time off policies, 4‑12 weeks fully paid parental leave based on tenure, 11 paid holidays, and additional flexible paid vacation and sick leave (U.S. benefits).

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable law.

Information obtained during the hiring process will be kept in strict confidence. For more information, review HP’s EEO Policy or read about your rights as an applicant under the law.