MEMS​/Microfluidics Design Engineer

Overview

HP Inc. is the world leader in Inkjet printing. We maintain this position by continuous innovation and advancement of the technology in our next generation products. Our inkjet technology is present in products that span the home, office, and industrial settings and is now the engine behind our high-speed digital printing presses and our 3D printing systems. The inkjet R&D organization has world class laboratories and capabilities in MEMS, life sciences, technical modeling, circuit design, mechanical systems, material science, ink chemistry, and print systems.

HP Engineers and Scientists leverage those capabilities for the development of next generation print systems and for emerging micro-fluidic applications and products in fields such as 3D printing, applied life science, and lab-on-a-chip medical devices. HP R&D is dedicated to providing advanced innovative solutions to our partners and customers.

• End to end ownership of design – from ideation, modeling, design for manufacturability in HP wafer fabrication equipment, and performance validation in HP’s custom test tooling.
• Modeling of performance characteristics of drop ejection designs including thermal, electrical, fluidic, and mechanical parameters.
• Design of new microfluidic MEMS drop ejection devices (CAD experience NOT necessary), including designing experiments (DOE) and statistical analysis.
• Test and characterization of ink/design interactions including drop weight, printhead energy, ejection reliability, dot shape placement, and printhead life.
• Advancement and integration of material science innovations for drop performance and printhead reliability.
• Development and advancement of test solutions to measure and monitor the performance of drops and printheads.
• Development of microfluidic technology for applications in life sciences, micro biomedical science, and advanced micro sensing markets.
• Partnering with other HP teams and groups (wafer fabrication, writing systems, ink chemists, firmware, electrical circuit designers) to develop, integrate, and validate new solutions.

• Bachelor's degree or Masters’ degree in an engineering discipline (Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering) - other disciplines may be considered with demonstrated technical proficiency in fluid mechanics
• Experience with/ classes covering fluid mechanics, thermodynamics, basic chemistry, basic circuits, programming (any language), modeling (any software).
• Willingness to learn as on the job training is provided and expected.
• Demonstrated working knowledge of engineering fundamentals
• Skilled in analytical decision-making, troubleshooting and problem-solving. Proficiency in practical experiment design and knowledge of applied statistics.
• Ability to work & effectively interact with team members from other disciplines, projects, organizations, cultures, HP sites, product divisions, and companies.
• Resourceful, creative and flexible.
• Ability to exercise independent judgment, while working within defined policies and practices.
• Exhibit solid planning, organizational and documentation skills.
• High degree of commitment and initiative.
• Fluent spoken and written English.

• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

The pay range for this role is $83,000 to $110,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave

For reference, benefits details may be available at the HP benefits site:

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.