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Fab Process Engineer

Job in Corvallis, Benton County, Oregon, 97331, USA
Listing for: HP Inc.
Full Time position
Listed on 2026-07-06
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Chemical Engineering, Quality Engineering
Salary/Wage Range or Industry Benchmark: 93400 - 143800 USD Yearly USD 93400.00 143800.00 YEAR
Job Description & How to Apply Below
Fab Process Engineer

** Description -*
* ** Job Summary*
* The process engineer is a team member of the MEMS organization and is responsible for sustaining the existing generation of technology, leading and supporting the transition of products and manufacturing processes from prototype to full production, and for developing new processes in support of new product or technology development. The process engineer is responsible for employing equipment technology, process technology and problem-solving methodologies to improve manufacturing performance, decrease proto cycles of learning, and enable the development of next-generation technology.

The process engineer is the technical leader of their respective work center, and is expected to partner with world-wide work center counterparts, Operations, Integration Engineering and Product Engineering. The process engineer specifies tooling and equipment that is necessary for work center Assurance of Supply and throughput requirements and uses the organization's capital expenditure process to purchase the tooling. The process engineer also takes an active role in the MEMS quality system.

** Responsibilities*
* + Uses Design of Experiment methodology to characterize process space and develop new production processes. Creates test plans to validate processes.

+ Qualifies new production processes using organizational change management procedures, in partnership with engineering and operations stakeholders.

+ Specifies new tooling and capital equipment purchases that are necessary for work center Assurance of Supply

+ Leads the work center and drives improvement in the following key areas: process sustaining, quality, equipment and capacity, and process development.

+ Exercises technical judgement, creativity, and initiative with attention to detail consistently throughout work output.

+ Collaborates and communicates with management, worldwide engineering partners, internal, and outsourced development partners regarding status, project progress, and issue resolution.

+ Leads project team of other process engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.

+ Represents the work center team for all phases of larger and more- complex development projects.

+ Solves difficult and complex problems with fresh perspective, demonstrating good judgment in selecting creative solutions and managing projects independently.

+ Delivers professionally written reports, and supports realization of operational and strategic plans.

+ Provides guidance and mentoring to less- experienced staff members to set an example of process design and development, innovation, and excellence.

** Education & Experience*
* ** Recommended*
* + Four-year or Graduate Degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or other related discipline.

+ Typically has 4-7 years of work experience, preferably in wafer or package fab process engineering, with experience in process development, stabilization, sustaining, and quality systems.

+ Prior experience with Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), and Plasma Enhanced Chemical Vapor Deposition (PECVD) strongly preferred.

** Knowledge & Skills*
* + Process development and characterization

+ Process qualification

+ Change management

+ Process and tooling

+ Equipment specification

+ Technical communication

+ Electrical Engineering

+ Chemical Engineering

+ Mechanical Engineering

+ Materials Science

+ Physics

+ Wafer fab

+ Package fab

+ Plasma physics

+ Plasma processes

+ Atomic Layer Deposition (ALD)

+ Physical Vapor Deposition (PVD)

+ Plasma Enhanced Chemical Vapor Deposition (PECVD)

The pay range for this role is  **$93,400
** to  **$143,800
** USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

** Benefits:*
* HP offers a comprehensive benefits package for this position, including:

+ Health insurance

+ Dental insurance

+ Vision insurance

+ Long term/short term disability insurance

+ Employee assistance program

+ Flexible spending account

+ Life insurance

+ Generous time off policies, including;

+ 4-12 weeks fully paid parental leave based on tenure

+ 11 paid holidays

+ Additional flexible paid vacation and sick leave (US benefits overview () )

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

** Job -*
* Engineering

** Schedule -*
* Full time

** Shift -*
* No shift premium (United States of America)

** Travel -*
* Not Specified

** Relocation -*
* Yes

** Equal Opportunity Employer (EEO)**   **-*
* HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex,…
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