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Wafer Bonding Engineer: MEMS Process Innovator
Job in
Corvallis, Benton County, Oregon, 97333, USA
Listed on 2026-07-11
Listing for:
Hewlett Packard Enterprise
Full Time
position Listed on 2026-07-11
Job specializations:
-
Engineering
Manufacturing Engineer, Process Engineer
Job Description & How to Apply Below
Hewlett Packard Enterprise seeks a Wafer Bond Process Engineer to own wafer bonding processes for MEMS manufacturing and support both high-volume production and next-gen product development.
You will sustain and improve bonding processes, lead development of new bonding technologies, and partner with Operations, Equipment Engineering, and Product teams to drive manufacturing excellence.
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