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Senior Wafer Bonding Process Engineer MEMS & NPI
Job in
Corvallis, Benton County, Oregon, 97333, USA
Listed on 2026-07-15
Listing for:
HP
Full Time
position Listed on 2026-07-15
Job specializations:
-
Engineering
Process Engineer, Quality Engineering
Job Description & How to Apply Below
HP is seeking a Process Engineer to lead wafer bonding technologies for MEMS in Corvallis. The role combines sustaining existing processes with developing new bonding methods, materials, and equipment, partnering across Operations, Engineering, and Quality.
You will own process specifications, set robust controls, and drive continuous improvement using SPC/DOE and risk-based methods. A strong manufacturing leadership mindset is essential.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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