Plating Process Engineer

Responsibilities

• Manage process based on understanding the plating process
• Operate plating process and equipment and analyze optimization condition
• Maintain processes in accordance with customer specifications and internal operational standards
• Develop and standardize process recipes through structured engineering practices
• Perform statistical process control and monitoring using appropriate statistical tools
• Analyze defects and implement continuous process improvement
• Perform engineering and process-related tasks in a semiconductor cleanroom environment while following strict contamination control procedures and safety protocols

• Understanding ofchemicalconcentration analysis devices and methods
• Proficiency in Microsoft Excel and statistical analysis tools such as JMP or Minitab
• Strong organizational, interpersonal, and communication skills
• Ability to work in a semiconductor cleanroom environment and safely handle or be exposed to chemicals commonly used in semiconductor manufacturing processes

• Ability to work independently with minimal supervision while meeting commitments and deadlines
• Ability to quickly learn and adapt to new technologies and processes
• Highly motivated, self-driven, and detail-oriented with a strong work ethic

• Bachelor’s degree in mechanical, Chemical Engineering, or related fields

• 1-year experiences in Semiconductor, PWB, OSAT preferred but not required

• $70,000 – $80,000

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• PTO and self-development