Dielectric and Polymer Materials Engineer

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly.

Requirements:
This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

• Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
• Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build‑up
• Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
• Evaluate emerging dielectric materials and technologies (e.g., low‑Dk/Df, glass core compatible systems) for roadmap fit
• Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
• Investigate and resolve adhesion, delamination, cracking, or CTE‑mismatch failures through materials and process analysis
• Run reliability qualification testing (HAST, TCT) and interpret dielectric‑driven failure mechanisms

• Hands‑on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
• Deep knowledge of dielectric patterning approaches: photo exposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non‑photosensitive films
• Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
• Understanding of dielectric‑to‑metal adhesion, CTE mismatch, and stress management in multilayer stacks
• Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
• Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
• Fluent in English; proficiency in Korean is a plus.

• Direct experience with glass core or glass interposer dielectric process integration
• Deep Familiarity with low‑Dk/low‑Df materials targeting high‑frequency and AI/HPC applications
• Knowledge of plasma‑enhanced CVD or PVD inorganic dielectrics for thin‑film packaging
• Experience with CMP of dielectric films in damascene or hybrid bonding contexts
• Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB‑SEM, TEM, laminography)
• Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
• Track record of material supplier engagement and collaborative efforts for material testing and qualification
• Publication record or patent activity in dielectric materials for packaging is a plus

• Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
• M.S. with 3+ years of relevant industry or research experience considered
• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)