System Design Engineer; PMIC SIP and Module
Listed on 2026-07-09
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Engineering
Electrical Engineering, Electronics Engineer, Systems Engineer, Hardware Engineer
Job Title
Package/System Design Engineer
Job DescriptionThe IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).
ResponsibilitiesExperience in board level system design, schematic drawing, component selection, performance optimization and verification.
IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment
System level co-design methodology of IC, Package and PCB/Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk. And RF. And RF constraints for impedance matching, coupling, desense.
Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Minimum QualificationsBachelor's degree in Engineering, Information Systems, Computer Science, or related field.
2+ years Hardware Engineering experience or related work experience.
Preferred QualificationsExperience in IC package and/or PCB selection, design, and layout experience - Experience in Pinmap optimization of optimal PCB design
Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
Working knowledge of die floor planning, IO placement, and bump placement
Working knowledge of Chip, Package and PCB co-design methodology
Familiar with assembly and substrate manufacturing process
Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with PCB stack-up and breakout strategy
Educational RequirementsBachelor's Electrical Engineering and/or Mechanical Engineering.
Preferred:
Master's, Electrical Engineering.
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