Semiconductor Operations - SiP Productization

Semiconductor Operations - SiP Productization

Location:

Cupertino, California, United States Operations and Supply Chain

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The Apple Semiconductor Operations team seeks a motivated, highly technical Component SiP productization engineer focusing on product and process development, supplier readiness, and high‑volume manufacturing quality. This role drives NPI execution, process bring‑up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high‑density module technologies. The successful candidate will work with module integration suppliers, OSATs, sub‑component vendors, PCB/substrate suppliers, and system integration sites, interfacing regularly with Engineering, Operations, Reliability, and Quality teams.

• Deliver high‑density and high‑performance SiP/module technologies within thermo‑mechanical, performance, reliability, quality, cost, and form‑factor constraints.
• Support advance Component SiP and system integration development for future products, including design rules, process bring‑up, and materials/process selection.
• Drive quality readiness at vendor factories for development builds, risk ramp, and mass production.
• Lead supplier readiness across NPI phases, including process BKM lock, build‑exit criteria, factory audits, qualification status, and ramp‑risk closure.
• Resolve process, yield, reliability, and quality issues in product and manufacturing processes.
• Use data analysis and failure analysis to identify gaps in component design, package architecture, process capability, inspection coverage, and test readiness.
• Work with vendors and OEM/system integration sites to ensure compliance with Apple specifications and manufacturing requirements.
• Ensure qualification and reliability activities at suppliers align with product and process requirements.
• Partner closely with component design, hardware engineering, reliability, PD FEA/simulation, operations, and quality teams.
• Provide routine status reporting to leadership and expedite technical, quality, and supplier execution issues when needed.

• Strong experience in SiP, semiconductor packaging, module assembly, or advanced packaging, including knowledge of assembly processes, materials, substrates, and package‑level failure mechanisms.
• 5+ years of relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high‑volume manufacturing.
• MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.
• Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
• Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board‑level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
• Strong interpersonal skills to collaborate with design, development, operations, reliability, quality, supplier engineering, and other cross‑functional teams.

• Hands‑on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
• Ability to take advanced packages or modules from concept and development builds to high‑volume manufacturing.
• Experience with RF, mmWave, antenna module, wireless module, high‑density package, or advanced SiP architecture.
• Ability to communicate technical risk clearly, drive issue closure, and provide concise executive‑level updates.
• Self‑motivated, good communicator, and able to lead complex issues across global suppliers.