Sr PCBA Manufacturing Engineer, Trainium Manufacturing, Quality and Reliability

Overview

Leading the manufacturing of AI servers and systems built on Trainium chips across cross‑geographical ODMs and CMs. The role is part of the Manufacturing, Quality and Reliability team at AWS Annapurna Labs, focusing on machine learning products that design cutting‑edge AI platforms for the world’s largest cloud services provider.

• Work with design engineering to provide PCB/PCBA design for manufacturability (DFM) feedback and identify manufacturing challenges early.
• Identify opportunities for risk reduction and simplification of PCBA manufacturing processes.
• Deliver manufacturing process capabilities, including equipment capability, quality controls, materials characterization, and standardized rework practices.
• Investigate and develop new manufacturing technology and methodologies to enhance PCBA quality, reliability, throughput, and cost.
• Drive the PCBA manufacturing qualification process at the CM, defining readiness requirements and leading key milestone reviews.
• Identify and validate product/component risks, working with design teams to mitigate them and define test methodology and coverage.
• Drive closure of all operational issues during pre‑production builds and implement/process optimization to improve yields for production ramp.
• Investigate failures/defects in production, test, and integration, identifying root causes for continuous improvement.
• Monitor product and process success through production ramp, providing regular status reports of PCBA progress.
• Provide technical leadership and mentor junior engineers.
• Work with multiple vendors and ODMs to standardize component manufacturing and reliability expectations.
• Work with system engineering teams to enforce DFM, DFA, and DFS principles and identify manufacturing challenges.
• Introduce new manufacturing technology and methodology to enhance product quality and production efficiency.
• Develop or adapt manufacturing processes at ODMs and CMs, including fixture, assembly, test, signal integrity, power, and heat management requirements.
• Manage product lifecycle changes, lead quality and reliability improvement projects, and drive root cause analysis for supplier defects.
• Implement and optimize manufacturing 1st‑pass yields and efficiency from prototype to product ramp.
• Support cost‑reduction and sustaining activities.

• 6+ years of root cause analysis and process design experience.
• 7+ years of new product introduction (NPI) experience.
• Bachelor’s degree or higher in Mechanical, Electrical, Industrial Engineering, or related STEM field.
• 5–8 years of experience in SMT and PCBA process engineering, including high‑volume production.
• Deep knowledge of SMT line processes (stencil, SPI, pick‑and‑place, reflow, AOI, X‑ray).
• Expertise in Design for Manufacturability (DFM) and Design for Testability (DFT).

• Master’s degree or equivalent, or experience with DFx (Design for cost, test, manufacturing).
• Expert knowledge of IPC-A-610H, J‑STD‑001H, IPC-A-600, and IPC‑7711/21.
• Strong experience with SMT lines, including stencil printing, pick‑and‑place, reflow, AOI, 5DX, and conformal coating/underfill application.
• Experience with flying probe testing, Design of Experiments (DOE), and root cause analysis tools such as 8D or Six Sigma.
• Familiarity with PLM/PDM systems (Agile, Teamcenter, SAP) and ERP/MES systems.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.