Module Design Engineer Architect

Module Design Engineer Architect

We are seeking a highly skilled Camera Design Engineer Architect to lead the end-to-end electrical architecture definition and system integration of next-generation camera modules across Apple's product portfolio. This role focuses on architecting the complete electrical signal chain from image sensor to SoC ISP, defining power delivery networks, high-speed interface topologies, and control-plane architectures that enable industry-leading imaging performance.

The ideal candidate will possess deep electrical engineering expertise with extensive knowledge in mixed-signal design, high-speed serial interfaces, and camera subsystem architecture. Strong technical proficiency is required in understanding CMOS image sensor readout architectures, MIPI CSI-2, ACI or ALPDP interface design, camera actuator (VCM, OIS) driver topologies, flash/strobe subsystems, and low-noise power management for imaging applications (including LDO/DC-DC selection, PSRR budgeting, decoupling strategy, and dynamic power state transitions).

The architect must have thorough understanding of camera module electro-optical performance trade-offs, EMI/EMC considerations, and signal integrity constraints to define electrical solutions that meet aggressive image quality, power, and form-factor targets in consumer electronics applications including iPhone, iPad, Mac, Vision, and wearable devices.

Beyond core architecture definition, this role demands hands-on involvement across the full product lifecycle, including driving pre-silicon architecture studies with SoC ISP and PMIC teams, defining board-level schematic and layout guidelines for camera subsystems, and ensuring architectural intent is preserved from concept through mass production. The architect will lead cross-functional design reviews and technical trade studies by providing quantitative analysis of architecture options, respond to bring-up and validation issues with deep debug of high-speed signaling and power integrity, and drive systematic root cause analysis on architectural gaps discovered during EVT/DVT/PVT phases.

This position serves as a critical technical bridge between image sensor suppliers, SoC design teams, module mechanical designers, and system product design, requiring expertise in both camera electrical architecture and practical implementation in high-volume, high-reliability manufacturing environments.

• Define end-to-end electrical architecture for camera subsystems including sensor-to-SoC signal chain, MIPI CSI-2, ACI, ALPDP lane budgeting, clocking topology, reset/control sequencing, and multi-camera synchronization schemes
• Architect power delivery networks for image sensors, actuators (VCM/OIS), and flash subsystems, including rail partitioning, PSRR budgeting, transient response requirements, and low-noise regulator selection to meet stringent image quality targets
• Lead high-speed interface design and signal integrity analysis for MIPI, ACI or ALPDP lanes, including channel budgeting, connector/flex selection, EMI mitigation, and pre/post-layout SI/PI simulation correlation
• Define schematic and PCB/flex layout guidelines for camera modules and system boards, including reference designs, layer stackup requirements, impedance targets, and DFM/DFT rules for global manufacturing
• Drive cross-functional architecture reviews with SoC ISP, PMIC, RF, mechanical, and optics teams to align on power budgets, thermal envelopes, form factor constraints, and testability requirements
• Partner with image sensor and actuator suppliers to influence next-generation silicon roadmaps, review datasheets and errata, and negotiate interface, power, and reliability specifications
• Support EVT/DVT/PVT bring-up and validation by leading debug of high-speed link failures, power integrity issues, EMI/ESD events, and image-quality-linked electrical root causes
• Lead FACA (Failure Analysis and Corrective Action) investigations by developing electrical characterization methodologies and diagnostic strategies to identify root causes of camera subsystem failures across engineering builds and mass production
• Analyze electrical margin data, temperature/voltage corner sweeps, and yield signatures to drive design guard bands, screening strategies, and preventive design changes across product generations
• Maintain comprehensive architecture documentation including block diagrams, interface specifications, power state tables, timing diagrams, and compliance matrices for internal teams and suppliers
• Participate in design reviews with camera module, system board, and product design teams to ensure architectural integrity, testability, and validation coverage throughout the product lifecycle
• Interface with camera algorithm, ISP firmware, and system software teams to translate imaging use cases (HDR, ProRAW, Cinematic mode, low-light, high-frame-rate video) into concrete electrical architecture and power state requirements

• BS degree in Electrical…