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Cloud Hardware Mechanical Engineer - Thermal/Packaging Lead
Job in
Cupertino, Santa Clara County, California, 95014, USA
Listed on 2026-08-08
Listing for:
Amazon Web Services (AWS)
Full Time
position Listed on 2026-08-08
Job specializations:
-
Engineering
Mechanical Engineer
Job Description & How to Apply Below
Annapurna Labs (U.S.) Inc. in Cupertino seeks a Cloud Hardware Development Engineer (Thermal/Mechanical) to own the complete thermal and mechanical design for ML/AI accelerator platforms—ranging from rack-level infrastructure to chip packaging.
You will develop CFD/FEA models, lead cross-functional design reviews, mentor engineers, and drive cost optimization with suppliers while ensuring reliability at scale in AWS data centers. Strong GD&T and high-density cooling experience are required.
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