Principal Hardware Manager H​/F

Key Responsibilities

• Work on next generation residential gateways and Wi‑Fi technologies deployed worldwide
• Be part of a global R&D organization with strong local ownership and decision‑making
• Collaborate with hardware, RF, software, mechanical, and chipset partners
• See your designs go from concept to mass production
• Thrive in a fast paced, innovative, and multicultural environment

We are seeking a highly experienced Principal Hardware Manager to lead the definition, architecture, and development of next‑generation residential broadband products. In this strategic leadership role, you will drive hardware innovation, guide technical direction, and manage high‑performing engineering teams delivering cutting‑edge connectivity solutions.

As a key member of the R&D leadership team, you will own the end‑to‑end hardware strategy and architecture of broadband products, from early technology scouting to product industrialization. You will lead cross‑functional teams, drive innovation, and ensure alignment between technical execution and business objectives.

• Lead technology scouting and maintain a strong technology watch on broadband silicon and wireless trends (Wi‑Fi evolution, coexistence, power efficiency, performance optimization).
• Define and drive chipset and platform selection (SoC, Wi‑Fi, connectivity, memory, power management) based on performance, cost, lifecycle, and roadmap alignment.
• Co‑define product specifications with Product Management, ensuring alignment with market needs, standards, and customer requirements.
• Act as a technical leader in innovation, driving differentiation and new product concepts.
• Partner with Procurement to evaluate cost structures, sourcing risks, and long‑term component availability.
• Own and define system and hardware architecture across broadband product lines, ensuring scalability and reuse across generations.
• Lead high‑level hardware design activities, including:
  • PCB partitioning and functional allocation across one or multiple boards
  • System block diagrams and pre‑placement definition
  • Mechanical form factor alignment with market and customer expectations
• Collaborate closely with RF and mechanical teams to ensure optimal integration and performance.
  • EMC/EMI and RF constraints
  • Thermal and mechanical integration
  • Manufacturability and cost (Design‑to‑Cost)
• Drive early BOM estimation and product cost analysis in collaboration with Procurement.
• Lead and develop a multidisciplinary hardware engineering team.
• Define priorities, allocate resources, and monitor execution using KPIs and milestones.
• Foster a high‑performance engineering culture focused on ownership, innovation, and.
• Set annual objectives, mentor technical leaders, and support talent development and succession planning.
• Oversee collaboration with global R&D teams, especially with France‑based engineering experts.
• Manage and coordinate hardware suppliers, partners, and design houses.
• Serve as the primary technical interface during pre‑sales engagements and RFP responses with telecom operators and key customers.
• Represent the US R&D center at a high technical level internally and externally.
• Drive and animate local technical expertise, ensuring strong alignment with global R&D capabilities.
• Support strategic customer discussions with deep technical insight and credibility.

• You hold MS or PhD in Electrical & Computer Engineering, Wireless Communications or a related technical field from a recognized US or international university.
• You have at least 10 years of experience in the design and delivery of complex hardware products.
• Proven experience in technical leadership and team management.

• Strong experience defining scalable system and hardware architectures for broadband devices.
• Ability to balance performance, cost, time‑to‑market, and risk in architectural decisions.

• High‑speed interfaces:
  Ethernet, PCIe, DDR, Ser Des.
• Mechanical integration: enclosure design, injection molding, thermal management.
• Regulatory compliance: FCC, UL, PTCRB, CE.

• Access technologies: GPON, EPON, DOCSIS, LTE, 5G.
• Connectivity:
  Wi‑Fi, Ethernet, BLE, Thread.

• Wi‑Fi 6 / 6E (802.11ax), Wi‑Fi 7 (802.11be).
• 4G (3
  
  GPP Rel. 8‑14), 5G (Rel. 15+).
• ISM technologies:
  Bluetooth, Zigbee, Matter.

• Strong ownership mindset with a strategic and results‑driven approach.
• Proven ability to lead and inspire cross‑functional and international teams.
• Excellent communication and stakeholder management skills.
• Strong organizational and prioritization capabilities.
• Analytical, detail‑oriented, and solution‑focused.
• Comfortable in fast‑paced, innovation‑driven environments.
• Ability to manage multiple complex initiatives simultaneously.