Manager, Process Engineering

Manager of Process Engineering

Form Factor is launching a large-scale, high-impact startup operation in Farmers Branch—an exciting opportunity to help build, define, and lead a cutting-edge manufacturing environment from the ground up. As part of a collaborative and people-centered culture, you will shape both the technology and the team that powers our next phase of growth.

The Manager of Process Engineering is a first-level people manager responsible for leading a focused team of process engineers and technicians supporting a vertically integrated probe card manufacturing operation. This hands-on role provides day-to-day direction for process development, optimization, qualification, and sustaining activities across semiconductor-style fab processes, probe stitching, and SMT-based vertical probe card assembly. Working under the guidance of senior engineering leadership, the Manager will coach team members, coordinate priorities, resolve manufacturing issues, and deliver measurable improvements in safety, quality, yield, cycle time, and cost.

• Supervise, coach, and develop a team of process engineers and technicians supporting fab processes, probe assembly, SMT operations, and new product introduction.
• Translate department goals into clear daily priorities, assignments, and deliverables.
• Provide regular feedback, support skill development, and foster cross-training within the team.
• Monitor key engineering metrics, including yield, Cp/Cpk, cycle time, OEE, and defectivity, and lead corrective actions when performance falls below target.
• Partner with Manufacturing Operations, Quality, Equipment Engineering, and senior engineering leaders to meet output, quality, and cost objectives.

• Oversee processes such as thin-film deposition, lithography, etch, metallization, planarization, cleaning, and metrology.
• Ensure robust process controls (SPC, DOE, FMEA) and maintain high-yield, stable wafer-type production flows.
• Lead qualification and integration of new fab equipment, chemistries, materials, and automation.

• Own all processes related to laser cutting, probe stitching, alignment, and mechanical integration.
• Develop breakthrough process capabilities to improve probe coplanarity, electrical performance, and mechanical reliability.

• Oversee SMT assembly processes, including solder paste deposition, component placement, reflow, AOI, underfill, etc.
• Develop and optimize assembly flows for vertical probe cards, integrating substrates, MEMS structures, interposers, connectors, and mechanical fixtures.
• Ensure DFM standards and process scalability for new card architectures.

• Lead root-cause analysis for yield excursions, field returns, and reliability failures.
• Implement structured problem-solving frameworks (8D, 4C).
• Drive automation, SPC dashboards, digital manufacturing systems, and advanced analytics into process control.

• Partner with R&D to industrialize new probe card technologies, ensuring manufacturability and cost competitiveness.
• Work with Supply Chain on material qualification, vendor capability, and risk mitigation.
• Collaborate with Quality Engineering to ensure compliance with industry standards and customer specifications.

• Ensure all processes meet EHS, chemical handling, and equipment safety requirements.
• Maintain robust documentation for processes, change control, FMEA, control plans, and work instructions.
• Lead process audits and customer technical reviews.

• Bachelor's degree in Mechanical, Electrical, Materials, Chemical, Manufacturing Engineering, or a related field; a master's degree is a plus.
• 5+ years of relevant experience in semiconductor manufacturing, probe card manufacturing, advanced packaging, MEMS, or another high-precision manufacturing environment.
• Demonstrated leadership through technical lead, project lead, mentor, supervisor, or similar responsibilities; prior formal people-management experience is preferred but not required.
• Working knowledge of process engineering, statistical analysis, structured problem-solving, SPC, DOE, FMEA, and control plans.
• Experience in one or more relevant areas, such as probe card manufacturing, MEMS probe technologies, micro-assembly, wafer fabrication, or advanced packaging.
• Familiarity with SMT, precision alignment, metrology, equipment qualification, reliability testing, factory automation, or MES systems is beneficial.
• Strong technical judgment, organization, communication, and hands-on manufacturing problem-solving skills.
• Ability to communicate clearly with technicians, engineers, cross-functional partners, and management.
• Ability to balance team leadership with hands-on technical support and timely escalation of complex issues.
• Commitment to employee development, safety, quality, accountability, and…