Sr Staff Integration Engineer

Sr. Staff Integration Engineer

Form Factor, Inc. is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon Form Factor's products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

The regular hours for this position are day shift.

The Sr. Staff Integration Engineer is responsible for defining, optimizing, and sustaining end-to-end process integration flows for probe card manufacturing in a high-volume semiconductor environment. This role serves as a senior technical authority, integrating complex unit processes across wafer-level fabrication, MEMS, precision assembly, interconnect, and electrical test.

The position drives yield performance, manufacturability, and scalability by aligning cross-functional engineering, operations, and product teams. The role operates with significant autonomy, leading cross-module problem solving, technology transfer, and continuous improvement initiatives, while mentoring engineers and influencing integration strategy across sites.

This role acts as the primary technical interface between process modules, ensuring integrated process flows meet product, quality, and reliability requirements.

Key Responsibilities:

Assembly & Test Integration Leadership

• Own integration strategy across all Assembly & Test operations including Solder paste printing, Surface mount technology (SMT), Pick-and-place assembly, reflow soldering, PCB assembly, Underfill and adhesive processes, Mechanical assembly, Alignment and calibration, Electrical verification, and Final product test.
• Define process windows, acceptance criteria, and control plans for critical assembly operations.
• Lead optimization of solder joint reliability, component placement accuracy, reflow profiles, coplanarity, and assembly yield.
• Drive integration improvements between PCB design, assembly processes, probe structures, and final electrical performance.
• Develop assembly flow architectures that support volume scalability, cycle-time reduction, and manufacturability.
• Partner with contract manufacturers and internal assembly operations to ensure process consistency and technology transfer success.
• Analyze assembly-related yield losses including solder defects, placement errors, opens, shorts, warpage, misalignment, and handling damage.
• Establish qualification methodologies for assembly materials, solder alloys, adhesives, PCB technologies, and new assembly equipment.

Process Integration Ownership

• Define, own, and continuously improve end-to-end process integration flows for probe card manufacturing.
• Ensure alignment of unit process performance to product-level electrical, mechanical, and reliability targets.
• Identify and manage integration risks, interactions, and trade-offs across modules.

Yield & Performance Optimization

• Lead integration-level yield improvement initiatives using data-driven analysis and structured problem solving.
• Investigate complex yield excursions, defect mechanisms, and cross-process interactions.
• Drive defect reduction, process capability improvements, and cycle time reduction.

New Product Introduction (NPI) & Technology Transfer

• Lead integration activities for NPI, pilot builds, and ramp to high-volume manufacturing.
• Own integration readiness criteria including process stability, control plans, and manufacturability.
• Support cross-site technology transfer and process replication with strong change control discipline.

Process Flow Development & Control

• Develop…