Process Technician - Wirebond

Process Technician - Wirebond

Location:

Dallas, TX, US, 75243

The Electro Optical Infrared Systems (EOIS) line of business within DRS has locations in Dallas and Austin, TX, Melbourne, FL, and Cypress, CA. EOIS develops, manufactures, and supports infrared and electro-optical solutions for soldiers, ground vehicles and airborne platforms. We offer an exciting and challenging work environment, a competitive salary and benefits package, and a business culture that rewards performance.

Process Assembly Technician for the wire bonding of focal plane arrays. This includes, but is not limited to, piece part handling, chemical handling, device inspection (optical microscope), and device assembly.

• Provide technical support to engineers and scientists on moderately complex components, devices, material, products, processes and/or equipment
• Responsible for testing, modifying, reworking, and repairing electronic, optical and mechanical assemblies
• Work from moderately complex wiring and assembly drawings, operation sheets, engineering specifications and sketches
• Design and test prototype assemblies and production units
• Use judgment in re‑working or re‑wiring to bring unit within quality control specifications
• Test, inspect, and repair electronic, optical or mechanical assemblies
• Work under minimal supervision and may provide guidance to other technicians
• Capable of performing related manufacturing processes
• Interpret and follow written documents such as SOPs and safety rules
• Ensure compliance with all safety and regulatory requirements applicable to the company in accordance with State and Federal regulations and any applicable certification required to maintain the certification
• May assist in training new team members
• Interface with other departments to assure efficient flow of information and materials
• Perform Key Performance Indicators:
• Quality of finished product (Pass/fail rates)
• Raw material stock levels
• Compliance outcomes
• Ability to coordinate several activities at the same time, and to reprioritize in response to changing operational conditions
• Support, communicate, reinforce and defend the mission, values and culture of the organization
• Operate various types of manufacturing, material growth reactors and/or process equipment to conduct complex experiments or to grow custom materials

• High School diploma is required.
• 2 or more years of equivalent technical experience in wire‑bonding, semiconductor device processing and testing, or semiconductor material handling. Direct experience in wire‑bonding desired.
• Ability to work with minimal direct supervision.
• Capable of working in a clean room environment. Work experience in a Class 100 clean room is recommended.
• Good manual dexterity.
• Good communication skills both written and verbal.
• Attention to detail and excellent data collection, documentation and reporting skills.
• Balance throughput requirements between different product areas with coordination between engineering and operations personnel including technicians, operators, planning, and other product areas.
• Must be able to work autonomously as well as in a team environment.

Working knowledge with computer skills such as Microsoft Excel, Word, and floor control or manufacturing execution systems (MES).

• Experience in wire bonding of semiconductor devices.
• Familiarity with automated and manual wirebonders.
• Ability to work with capillary setup and simple wirebonder maintenance a strong plus.
• Familiarity with wafer/piece part processing including manual handling of individual devices.
• Clean‑room experience with photolithography tools, optical microscopes, Nanospec etc is a plus.

U.S. Citizenship required. This position requires an active DOD security clearance or the…