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Lead Engineer, Lab Quality Engineering

Job in Danbury, Fairfield County, Connecticut, 06813, USA
Listing for: Entegris, Inc.
Full Time position
Listed on 2026-09-25
Job specializations:
  • Quality Assurance - QA/QC
    Quality Engineering
  • Engineering
    Quality Engineering, Process Engineer
Salary/Wage Range or Industry Benchmark: 108000 - 140000 USD Yearly USD 108000.00 140000.00 YEAR
Job Description & How to Apply Below

Job Title

Lead Engineer, Lab Quality Engineering

Job Description

The Role Entegris is currently seeking a Global Thin Film Metrology Quality Engineer to join our Analytical Laboratories team, based in our Danbury, Ct facility. In this role, you will Implement, sustain, and improve thin-film metrology methods for our Materials Solutions Coating operations. This cross-functional role partners with laboratory, R&D, process engineering, manufacturing, supplier quality, customer quality, and quality systems teams to strengthen measurement capability, reduce variation, govern change, support technology transfer, and improve audit readiness.

What

You’ll Do
  • Own quality oversight for thin-film and coating metrology methods, measurement systems, software workflows, and data packages within the assigned scope.
  • Develop, validate, verify, transfer, and maintain fit-for-purpose methods for film thickness, uniformity, surface morphology, roughness, composition, structure, adhesion, stress, and other critical-to-quality attributes.
  • Establish measurement controls, including calibration and verification strategy, reference standards, system suitability, control charts, uncertainty evaluation, gauge R&R, method correlation, matching, and inter-laboratory comparability.
  • Provide quality governance for instrument qualification, method changes, software changes, new capability introduction, and method transfers using approved change-control and risk-management processes.
  • Review abnormal trends, out-of-specification or out-of-trend results, measurement excursions, and data-integrity concerns; ensure appropriate containment, investigation rigor, root-cause analysis, CAPA, and effectiveness verification.
  • Use statistical methods to evaluate bias, precision, stability, capability, repeatability, reproducibility, and measurement-system contribution to total process variation.
  • Develop and maintain controlled procedures, method documentation, technical reports, validation protocols, training materials, qualification criteria, and audit-ready records.
  • Support internal, external, and customer audits as needed; provide objective technical evidence and clearly communicate method capability, measurement uncertainty, data limitations, and risk.
  • Translate product and process requirements into practical metrology strategies, sampling plans, acceptance criteria, and quality controls.
  • Drive alignment of best-known methods, instrument platforms, data review practices, and escalation criteria across sites while recognizing justified site-or product-specific requirements.
  • Build and maintain a thin-film metrology capability roadmap addressing capacity, redundancy, obsolescence, automation, digital integration, reference standards, and future business needs.
  • Provide technical coaching and training to engineers, scientists, chemists, and technicians; lead cross-functional improvement projects without direct supervisory authority.
  • Maintain a safe laboratory environment and ensure work follows applicable EHS, chemical-handling, equipment, and waste-disposal requirements.
What We Seek
  • Bachelor’s degree in chemistry, Physics, Engineering, Material Science or related field required, M.S. or Ph.D. preferred.
  • Minimum of 5 years of related experience in thin-film, coating, surface, semiconductor, advanced-materials, or precision-metrology environments.
  • Strong knowledge of analytical chemistry, materials science, physics, semiconductor materials, thin films, ceramic materials, and metrology.
  • Experience with thin-film metrology tools such as spectroscopic ellipsometry, reflectometry, profilometry, optical or confocal microscopy, interferometry, thickness mapping, AFM, SEM/EDS, XRR, XRD, or related surface and structural characterization techniques.
  • Demonstrat…
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