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Power Electronics Research Engineer

Job in Dearborn, Wayne County, Michigan, 48120, USA
Listing for: Ford Motor Company
Full Time position
Listed on 2026-05-31
Job specializations:
  • Engineering
    Electrical Engineering, Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

What You'll Do

  • Advanced IC Strategy & Architecture (PMIC, ASIC, SoC)
    • Strategic Roadmap Development:
      Lead the definition of long‑term technology roadmaps for Power Management ICs (PMIC) and Application Specific Integrated Circuits (ASIC), specifically tailored for traction inverters and gate drive applications.
    • Custom Silicon Definition:
      Define technical specifications and architectural requirements for custom SoC and ASIC solutions, focusing on the integration of sensing, protection, and control functions into mixed‑signal silicon.
    • System‑in‑Package (SiP) Integration:
      Drive the transition from discrete components to SiP solutions to minimize parasitic inductance and optimize the commutation loop for Wide Bandgap (SiC/GaN) devices.
    • BCD Process Evaluation:
      Evaluate and select appropriate Bipolar‑CMOS‑DMOS (BCD) process technologies for high‑voltage gate drivers and mixed‑signal control circuits.
    • Supply Chain & Foundry Interaction:
      Lead technical engagement with semiconductor foundries and Tier‑1 suppliers; conduct "Make vs. Buy" analyses for analog and mixed‑signal designs to ensure supply chain resilience and cost optimization.
  • Design, Simulation & Electromagnetics
    • Next‑Gen Converter Design:
      Design power electronic converters for electrified vehicles, integrating advanced filtering solutions with power modules, busbars, and PCBs.
    • EMI & Filter Optimization:
      Identify topology and design Common Mode (CM) and Differential Mode (DM) inductive chokes and decoupling capacitors. Build circuit models to estimate frequency generation and propagation in LV/HV circuits.
    • Noise Modeling:
      Perform modeling and laboratory verification of noise coupling mechanisms between HV power stages and LV gate drive/control PCBs.
    • Interconnect Design:
      Design HV busbars and DC‑link layouts to integrate seamlessly with passive filters and power modules, mitigating EMI cross‑talk.
  • Cross‑Functional Collaboration
    • System Integration:
      Interact with system design, semiconductor, and gate drive experts to meet requirements for high voltage, high‑current, and large gate drive operations.
    • Technical Leadership:
      Support interaction with inverter control experts, low‑voltage circuit designers, and electric machine specialists to ensure cohesive system architecture.
    • Communication:
      Effectively communicate strategic directions and technical results by writing technical reports, invention disclosures, and presenting executive summaries to management.
You'll Have
  • Master’s degree in Electrical Engineering with a focus on power electronics, mixed‑signal IC design, or semiconductor packaging.
  • 3+ years of research or industry experience in:
    • Architectural design of power electronic systems or PMIC/ASIC design.
    • Developing specifications for analog/mixed‑signal ICs in automotive or high‑power applications.
  • Power Electronics Technical Expertise
    • Expertise in circuit parameter extraction and transfer functions from CAD models.
    • Proficiency in Double Pulse Test (DPT) procedures to quantify semiconductor switching noise and map propagation paths.
    • Experience designing filters, chokes, and snubbers to attenuate noise in electric drive systems.
  • Lab & Analysis Skills
    • Expertise in high‑speed time‑domain and frequency‑domain signal acquisition (oscilloscopes, network/spectrum analyzers).
    • Knowledge of PCB design and layout for prototyping high‑power filter designs.
  • Ph.D. in Electrical Engineering (preferred).
  • Semiconductor & IC Expertise
    • Strong understanding of SoC and SiP trends, including 2.5D/3D packaging and their impact on thermal and electrical performance.
    • Knowledge of BCD process technologies and how they apply to high‑voltage gate driver and transceiver design.
    • Familiarity with the semiconductor manufacturing flow (fab, assembly, test) and IC design cycles (RTL to GDSII).
  • Functional Safety:
    Familiarity with ISO 26262 functional safety requirements as they pertain to PMIC and ASIC architecture (ASIL ratings).
  • Software Proficiency: MATLAB, PLECS, Simplorer, SPICE, Fusion 360, Altium, KiCAD.
  • Design Flows:
    Experience with EDA tools (Cadence, Mentor Graphics, Synopsys), FPGA prototyping, and the Siemens IC portfolio.
  • Domain Knowledge
    • Deep understanding of automotive requirements, including…
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