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Lead Expert Advanced Electronic Packaging - Taiwan

Job in Deerfield, Lake County, Illinois, 60015, USA
Listing for: IPC International, Inc
Full Time position
Listed on 2026-06-03
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Electrical Engineering, Electronics Technician
  • IT/Tech
    Systems Engineer, Electrical Engineering, Electronics Technician
Job Description & How to Apply Below
The Global Electronics Association is seeking a Technology Solutions Subject Matter Expert (SME) Consultant based in Taiwan. Reporting to the Vice President of Technology Solutions, this externally facing consulting role serves as a senior technical expert and industry convener, supporting the Association's global technology programs with a strong regional focus on Taiwan.

This role plays a critical part in shaping next-generation electronics manufacturing and advanced electronic packaging across the supply chain in Taiwan, East Asia, and globally. The consultant will work directly with OEMs, semiconductor and packaging companies, OSATs, substrate and PCB manufacturers, EMS/ODM providers, equipment suppliers, and research organizations to identify emerging technical challenges and drive the development of guidelines, standards, roadmaps, workshops, and training aligned with industry needs.

RESPONSIBILITIES

Technology Expertise & Advisory Leadership

Serve as a senior subject matter expert across component-level and system-level packaging, providing technical insight spanning advanced packaging, substrates, HDI/UHDI PCBs, assembly, test, and reliability. Advise on package-to-PCB-to-system integration topics including materials, design considerations, manufacturing processes, digital manufacturing, and scalability challenges for advanced electronic systems.

Next Gen Guidelines, Standards & Roadmap Development

Drive the identification, development, and execution of new guidelines, standards, and technical reports aligned with emerging industry requirements. Contribute expert input to technology roadmaps, white papers, and position statements addressing advanced packaging, substrates, PCB technologies, advanced assembly, digital manufacturing, quality and reliability, and sustainability.

Industry & Ecosystem Engagement

Act as a technical liaison within Taiwan's electronics ecosystem, engaging OEMs, semiconductor and packaging companies, OSATs, substrate and PCB manufacturers, EMS/ODM providers, equipment suppliers, and regional research partners. Foster new partnerships and collaborative initiatives across industry, academia, and government-aligned research organizations to strengthen regional and global alignment.

Workgroup Formation & Community Building

Establish and lead multi-company technical work groups, including Taiwan-focused AEP and ADEPT initiatives. Coordinate cross-company technical activities, guide technical direction, and apply data-driven approaches to address complex challenges; translating technical issues into clear opportunities and actionable outcomes. Grow and sustain a strong technical community within Taiwan.

Workshops, Events & Thought Leadership

Lead and support technical workshops, conferences, webinars, and industry forums across Taiwan and the region, while delivering senior-level thought leadership that informs industry dialogue and advances Technology Solutions priorities.

Training & Knowledge Development

Provide expert input to inform training materials, educational modules, and best-practice guidance. Identify gaps and opportunities for future Technology Solutions offerings, ensuring content reflects real-world manufacturing, design, and system deployment needs.

REQUIREMENTS

• Bachelor's degree in engineering, science, or a technology-related field

• Master's degree or PhD preferred; business degree (e.g., MBA) a plus

• 15+ years of experience within the electronics industry, with demonstrated technical leadership and sustained industry contributions

• Deep subject matter expertise in either or both:
o Component-level packaging (CLP), including next-generation packaging, advanced substrates, assembly, test, and reliability
o System-level packaging (SLP), including design, materials, assembly, test, and sub-system/final system reliability

• Broad technical and supply-chain experience across electronic hardware systems, including materials, design, HDI/UHDI PCBs, IDM/OSAT, EMS/ODM, digital manufacturing, and complex integrated systems

• Proven experience coordinating/leading multi-company technical collaborations, working groups, consortia

Strong communication skills, with the ability…
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