Senior Hardware​/Embeddded Systems Engineer – Edge AI Device Manufacturing

N2N Services Inc. empowers organizations of all sizes with secure, seamless AI and cloud integration through its flagship product, Helios, an Integration Platform as a Service (iPaaS). Light

LeapAI enables turnkey SaaS-to-SaaS and SaaS-to-on-premise data integration, simplifying the creation, management, and security of APIs without the need for complex programming or infrastructure.

N2N focuses on helping enterprises adopt cloud- and AI-first strategies, enabling them to leverage real-time automation, artificial intelligence, and analytics to thrive in today’s competitive digital economy. With a commitment to making integration accessible, N2N helps businesses achieve digital transformation and operational efficiency.

Senior Hardware / Embedded Systems Engineer - Edge AI Device (Prototype to Production)

We have built and validated a working bench prototype of an edge AI appliance - an NVIDIA Jetson-based smart assistant with integrated vision, audio, and projection. We need a hardware engineer to take it from "works on the bench" to a manufacturable, certified product: board, power, RF, thermals, enclosure, and the path to first production units.

• Turn the existing prototype into a production hardware package: block diagram, schematic capture, PCB layout, BOM, electronics packaging, and/or electromechanical design.
• Integrate a compute module (NVIDIA Jetson Orin/Thor-class SoM) on a production carrier; specify a custom carrier and a consolidated power board at volume.
• Design the power system: USB-C PD (sink/trigger controllers), DC-DC buck rails, a class-D audio supply, star-grounding, and EMI mitigation; optionally, an isolated-mains variant for fixed installs.
• Own thermals for sustained compute load in a sealed metal enclosure used as a passive heat spreader.
• Solve RF in a metal chassis: integrated slot/aperture antennas (or coordinate an RF specialist), feed/impedance matching, and EM simulation validation.
• Drive the CNC aluminum enclosure design, tolerances, and DFM in partnership with mechanical and contract manufacturers.
• Lead the compliance path: FCC Part 15 B/C, CE (CISPR 32/35, RED), IEC/UL 62368-1, RoHS/WEEE – including pre-compliance scans and engaging a test lab.
• Recommend vendors and CMs; support bring-up, bench validation, and early production runs; document for handoff.

• Demonstrated track record in taking electronic hardware from prototype to production.
• Strong schematic capture and PCB layout (Altium, KiCad, or equivalent), including carrier/baseboard design for compute modules.
• Working knowledge of EMC/EMI and safety certification processes.
• Thermal design for compute-heavy embedded systems.

• NVIDIA Jetson / SoM ecosystem and embedded Linux.
• RF/antenna design (slot/aperture antennas in metal enclosures; HFSS/CST/OpenEMS) and FCC modular-grant experience.
• Mechanical/enclosure design (CNC aluminum, PEM hardware) or close partnership with an ME.
• Experience shipping consumer/enterprise devices with camera/mic/audio subsystems.