Failure Analysis Engineering Manager

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity.

Position Overview

This engineering position will supervise and manage failure analysis functions within our advanced technology development team in support of new technology and product development, reliability assessment, and quality assurance. The ideal candidate will bring technical expertise across a broad spectrum of semiconductor technologies including wide band-gap, group III‑V and group IV technologies, proven leadership in building and scaling teams, and establishing internal FA lab capability and tool selection.

• Supervision and hands‑on operation of Failure Analysis tools including Hotspot detection and FIB/SEM
• Responsible for equipment evaluation, selection, acquisition and qualification
• Influence both process and product development strategies across MACOM’s B.U.’s to improve process/product performance and reliability, reduce reliance on external FA capability and cost and improve efficiency of FA execution.
• Build and manage a high performing Failure Analysis teams supporting MACOM’s broad process and product portfolios.
• Responsible for ensuring that sufficient equipment and people resources are in place and allocated appropriately to meet project schedules.
• Communicating updates to senior management regarding key projects and strategic planning, including budgeting, lab space management, and human resource requirements.
• Interfacing with process and product development, fab operations and quality assurance teams to ensure that the FA team consistently meets stakeholder needs
• Effectively communicating your results via final engineering reports. You need to be able to defend your findings/recommendations to designers, process experts, and management.

• Detailed knowledge of semiconductor device physics, reliability and associated failure modes and mechanisms.
• Skilled in the use of statistical software applications such as JMP or Minitab.
• Leadership, assertiveness, ability to be a team player with positive attitude. Excellent communication and presentation skills (both written and verbal)

• B.S. or B.A. in Physics, Materials Science, Electrical Engineering, or related field.
• 5+ years of experience of increasing responsibility in areas of failure analysis with emphasis on wide band-gap technologies.
• Detailed knowledge of semiconductor device physics, reliability and associated failure modes and mechanisms, focus on GaN HEMT devices.
• Skilled in the use of statistical software applications such as JMP or Minitab.
• Leadership, assertiveness, ability to be a team player with positive attitude.
• Excellent communication and presentation skills (both written, verbal) are required.

• Proven success in building and managing FA technical teams and labs.
• Demonstrated experience in FA equipment evaluation, selection, acquisition and qualification
• Demonstrated hands‑on…